Delamination cracking in encapsulated flip chips

被引：20
|
作者：
LeGall, CA [1 ]
Qu, JM [1 ]
McDowell, DL [1 ]
机构：
[1] GEORGIA INST TECHNOL,GEORGE W WOODRUFF SCH MECH ENGN,ATLANTA,GA 30332
来源：
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ECTC.1996.517422
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：430 / 434
页数：3
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