AI chips that flip

被引:0
|
作者
Stuart Thomas
机构
[1] Nature Electronics,
来源
Nature Electronics | 2023年 / 6卷
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:178 / 178
相关论文
共 50 条
  • [31] Fast underfill processes for large to small flip chips
    Babiarz, AJ
    Quinones, H
    Ciardella, R
    [J]. PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 55 - 58
  • [32] Lego-like reconfigurable AI chips
    Liang, Shi-Jun
    Miao, Feng
    [J]. NATURE ELECTRONICS, 2022, 5 (06) : 327 - 328
  • [33] Analogue chips for energy-efficient AI
    Conti, Silvia
    [J]. NATURE ELECTRONICS, 2023, 6 (09) : 644 - 644
  • [34] Industry Session II: DFT on AI Chips
    Zhong, Junna
    Ma, Iris
    Li, Hailong
    Huang, Yu
    [J]. 2023 IEEE 32ND ASIAN TEST SYMPOSIUM, ATS, 2023, : 244 - 244
  • [35] Analogue chips for energy-efficient AI
    Silvia Conti
    [J]. Nature Electronics, 2023, 6 : 644 - 644
  • [36] Lego-like reconfigurable AI chips
    Shi-Jun Liang
    Feng Miao
    [J]. Nature Electronics, 2022, 5 : 327 - 328
  • [37] Towards Strong AI with Analog Neural Chips
    James, A. P.
    [J]. 2020 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2020,
  • [38] Effect of circuit board flexure on flip chips before underfill
    Chengalva, MK
    Jeter, N
    Baxter, SC
    [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 657 - 665
  • [39] Adhesive flip chip assembly using plated bump chips
    Riley, GA
    [J]. TWENTY FIRST IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1997, : 313 - 318
  • [40] BEAM LEADS VS FLIP-CHIPS .2.
    SEGALLIS, B
    [J]. ELECTRONIC PRODUCTS MAGAZINE, 1969, 11 (12): : 10 - +