Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

被引：0
|
作者：
Yee-Wen Yen
Da-Wei Liaw
Kuen-Da Chen
Hao Chen
机构：
[1] National Taiwan University of Science and Technology,Department of Materials Science and Engineering
[2] National Taiwan University of Science and Technology,Graduate Institute of Engineering
来源：
Journal of Electronic Materials | 2010年 / 39卷
关键词：
Interfacial reaction; Sn-58Bi; Sn-9Zn; Au/Ni/SUS304 multilayer substrate; diffusion controlled;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The liquid/solid interfacial reactions of Sn-58Bi (SB) and Sn-9Zn (SZ) lead-free solders with Au/Ni/SUS304 multilayer substrates have been investigated in this study. In the SB/Au/Ni/SUS304 couple, only the Ni3Sn4 phase with needle-like grains was formed at the SB/Au/Ni/SUS304 interface. The Ni5Zn21 phase with a column structure was formed at the SZ/Au/Ni/SUS304 interface. The thickness of both intermetallic compounds (IMCs) increased with increasing reaction temperature and time. Meanwhile, the growth mechanism of these two IMCs is seen to follow a parabolic law and is diffusion controlled.
引用
收藏
页码：2412 / 2417
页数：5
相关论文
共 50 条
  • [41] Reinforcement of vanadium on the microstructure and properties of Sn-58Bi lead-free solder joints
    Yang, Li
    Zhou, Shiyuan
    Zhang, Yaocheng
    Zhu, Lu
    Xiong, Yifeng
    Jiang, Wei
    Shen, Sai
    MATERIALS RESEARCH EXPRESS, 2019, 6 (06)
  • [42] Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages
    Gain, Asit Kumar
    Chan, Y. C.
    Yung, Winco K. C.
    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2009, 162 (02): : 92 - 98
  • [43] Microstructure and Properties of Sn-9Zn Lead-Free Solder Alloy with In Addition
    Yang J.
    Peng Y.
    Chen D.
    Bai H.
    Li C.
    Yi J.
    Xiyou Jinshu/Chinese Journal of Rare Metals, 2022, 46 (08): : 1031 - 1040
  • [44] Dependence of frequency on Young's modulus and internal friction in Sn-9Zn and Sn-3.5Ag eutectic lead-free solders
    Ohoka, T
    Nakamura, Y
    Ono, T
    JOURNAL OF MATERIALS SCIENCE, 2004, 39 (13) : 4379 - 4381
  • [45] Corrosion Study of Sn-9Zn Lead-Free Solder in Alkaline Solution
    Nazeri, Muhammad Firdaus Mohd
    Affendy, Muhammad Ghaddafy
    Mohamad, Ahmad Azmin
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2012, 7 (05): : 4182 - 4191
  • [46] Effect of Cu addition on Sn-9Zn lead-free solder properties
    Huang, Huizhen
    Liao, Fuping
    Wei, Xiuqin
    Zhou, Lang
    Hanjie Xuebao/Transactions of the China Welding Institution, 2009, 30 (06): : 30 - 33
  • [47] Enhancement of solder properties of Sn-9Zn lead-free solder alloy
    Kamal, M.
    Gouda, E. S.
    CRYSTAL RESEARCH AND TECHNOLOGY, 2006, 41 (12) : 1210 - 1213
  • [48] Interfacial reactions of high-temperature Zn-Sn solders with Ni substrate
    Wang, Chao-hong
    Chen, Hsien-hsin
    Li, Po-yi
    MATERIALS CHEMISTRY AND PHYSICS, 2012, 136 (2-3) : 325 - 333
  • [49] Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer
    Huang, CW
    Lin, KL
    MATERIALS TRANSACTIONS, 2004, 45 (02) : 588 - 594
  • [50] Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate
    Chang, Tao-Chih
    Chou, Shih-Min
    Hon, Min-Hsiung
    Wang, Moo-Chin
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 429 (1-2): : 36 - 42
12345