Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

被引：0
|
作者：
Yee-Wen Yen
Da-Wei Liaw
Kuen-Da Chen
Hao Chen
机构：
[1] National Taiwan University of Science and Technology,Department of Materials Science and Engineering
[2] National Taiwan University of Science and Technology,Graduate Institute of Engineering
来源：
Journal of Electronic Materials | 2010年 / 39卷
关键词：
Interfacial reaction; Sn-58Bi; Sn-9Zn; Au/Ni/SUS304 multilayer substrate; diffusion controlled;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The liquid/solid interfacial reactions of Sn-58Bi (SB) and Sn-9Zn (SZ) lead-free solders with Au/Ni/SUS304 multilayer substrates have been investigated in this study. In the SB/Au/Ni/SUS304 couple, only the Ni3Sn4 phase with needle-like grains was formed at the SB/Au/Ni/SUS304 interface. The Ni5Zn21 phase with a column structure was formed at the SZ/Au/Ni/SUS304 interface. The thickness of both intermetallic compounds (IMCs) increased with increasing reaction temperature and time. Meanwhile, the growth mechanism of these two IMCs is seen to follow a parabolic law and is diffusion controlled.
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页码：2412 / 2417
页数：5
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