Copper Wire Bonding Concerns and Best Practices

被引：0

作者：

Preeti Chauhan

Z. W. Zhong

Michael Pecht

机构：

[1] University of Maryland,CALCE Electronic Products and Systems Center

[2] Nanyang Technological University,School of Mechanical and Aerospace Engineering

来源：

Journal of Electronic Materials | 2013年 / 42卷

关键词：

Wire bonding; copper; gold; oxidation; corrosion; humidity;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been implementing. The paper also provides information to enable customers to conduct qualification and reliability tests on microelectronic packages to facilitate adoption in their target applications.

引用

页码：2415 / 2434

页数：19

共 50 条

[1] Copper Wire Bonding Concerns and Best Practices
Chauhan, Preeti
Zhong, Z. W.
Pecht, Michael
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (08) : 2415 - 2434
[2] Copper Wire Bonding
Mayer, Michael
Lai, Yi-Shao
[J]. MICROELECTRONICS RELIABILITY, 2011, 51 (01) : 1 - 2
[3] Wire bonding using copper wire
Zhong, Z. W.
[J]. MICROELECTRONICS INTERNATIONAL, 2009, 26 (01) : 10 - 16
[4] Copper Wire Bonding: A Review
Zhou, Hongliang
Chang, Andong
Fan, Junling
Cao, Jun
An, Bin
Xia, Jie
Yao, Jingguang
Cui, Xiaobin
Zhang, Yingchong
[J]. MICROMACHINES, 2023, 14 (08)
[5] Effect of wire purity on copper wire bonding
Srikanth, Narasimalu
Premkumar, J.
Sivakurnar, M.
Wong, Y. M.
Vath, C. J., III
[J]. 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 755 - 759
[6] Overview of wire bonding using copper wire or insulated wire
Zhong, Z. W.
[J]. MICROELECTRONICS RELIABILITY, 2011, 51 (01) : 4 - 12
[7] Comparing the copper and gold wire bonding during thermalsonic wire bonding process
Pan, Yongjun
Zhu, Fulong
Lin, Xinxin
Tao, Jiaquan
He, Liping
Wang, Han
Liu, Sheng
[J]. 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 240 - 243
[8] Texture analysis of copper bonding wire
Baeck, SM
Park, KK
Ha, H
Oh, Y
Park, Y
Moon, JT
Lee, J
Oh, KH
[J]. TEXTURES OF MATERIALS, PTS 1 AND 2, 2002, 408-4 : 803 - 808
[9] PRACTICAL TECHNOLOGY OF COPPER WIRE BONDING
TOYOZAWA, K
OOMI, S
MINAMIDE, S
WAKAMOTO, S
MAEDA, T
[J]. SHARP TECHNICAL JOURNAL, 1989, (42): : 77 - 80
[10] Copper Wire Bonding - A Maturing Technology
Appelt, Bernd K.
Tseng, Andy
Lai, Yi-Shao
Chen, Chun-Hsiung
[J]. 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 479 - 483

← 1 2 3 4 5 →