Infrared Lock-in Thermography Crack Localization on Metallic Surfaces for Industrial Diagnosis

被引:0
|
作者
Y. Fedala
M. Streza
F. Sepulveda
J.-P. Roger
G. Tessier
C. Boué
机构
[1] ESPCI,LPEM
[2] NIR&DIMT,ESPCI, Institut Langevin
[3] UMR CNRS 7587,Neurophotonics Laboratory
[4] CNRS UMR 8250,LPEM, UMR CNRS 8213
[5] Université Paris 5 Descartes,undefined
[6] UPMC/ESPCI,undefined
来源
关键词
Infrared thermography; Lock-in thermography; Non-destructive testing; Crack localization;
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中图分类号
学科分类号
摘要
Optical lock-in thermography with a modulated laser excitation is used for the qualitative assessment of surface cracks in metallic samples. In order to identify and localize an open defect, a novel dedicated image processing of the recorded IR amplitude sequence is proposed. The obtained results demonstrate the potentiality of active lock-in thermography as a contactless measurement tool for the localization of breaking cracks located into specific regions difficult to reach by other conventional non-destructive testing (NDT) techniques such as eddy currents or ultrasound techniques. Crack localization without a prior preparation of the inspected surface can be a possible alternative to penetrant inspection in industrial processes. Various applications illustrating the proposed procedure are presented.
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页码:335 / 341
页数:6
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