Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

被引：0
|
作者：
Jicheng Gong
Paul P. Conway
Changqing Liu
Vadim V. Silberschmidt
机构：
[1] University of Oxford,Department of Materials
[2] Loughborough University,Wolfson School of Mechanical and Manufacturing Engineering
来源：
Journal of Electronic Materials | 2009年 / 38卷
关键词：
Lead-free solder; Sn-Ag-Cu; micromechanical testing; dislocations;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
To study the intragranular mechanical behavior of a Sn-Ag-Cu solder, a focused ion beam system was used to manufacture a notched microspecimen at a eutectic area within a grain. A low-speed tensile test was performed on the microspecimen using an Instron 5848 microtester at room temperature. The results show that, besides an obvious shearing deformation, a large number of subgrains are formed in the β-Sn matrix. Subgrain boundaries are composed of a large number of dislocations. Besides the heterogeneous deformation due to the notch, Ag3Sn intermetallic compounds influence the evolution path of subgrain boundaries.
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收藏
页码：2429 / 2435
页数：6
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