Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition

被引：6

作者：

Watanabe, Hirohiko ^{[1
]}

Shimoda, Masayoshi ^{[1
]}

Hidaka, Noboru ^{[1
]}

Shohji, Ikuo ^{[2
]}

机构：

[1] Fuji Elect Holdings Co Ltd, 1 Fuji Machi, Hino, Tokyo 1918502, Japan

[2] Gunma Univ, Grad Sch Engn, Tenjin, Kiryu 3768515, Japan

来源：

FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2 | 2011年 / 462-463卷

关键词：

Sn-Ag-Cu-Ni-Ge; IMCs; Cu6Sn5; Cu3Sn; Lead-free solder; KINETICS;

D O I：

10.4028/www.scientific.net/KEM.462-463.247

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Sn-Ag-Cu-Ni-Ge solder alloy has been developed to improve the mechanical properties of the Sn-Ag-Cu base solders and prevent oxidation of those solders. In this paper, an interfacial reaction and microstructure between the solder and a Cu electrode were investigated under heat exposure conditions. It was found that intermetallic compounds growth at the interface of the solder and the Cu electrode was greatly affected by amounts of added elements. Adding Ni in the solder can suppress the formation and growth of intermetallic compounds (IMCs) such as Cu-Sn and decreasing the amount of adding Ag in the solder can prevent the formation and growth of Ag3Sn. Moreover, it was found that there was an effect of suppress the growth of the Cu3Sn formed on the interface of Cu and (Cu,Ni)(6)Sn-5 by adding Ni from analysis results of EDX and TEM.

引用

页码：247 / +

页数：2

共 50 条

[1] Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review
Lee, Liu Mei
Mohamad, Ahmad Azmin
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2013, 2013
[2] Influence of solder volume on interfacial reaction between Sn-Ag-Cu solder and TiW/Cu/Ni UBM
Wong, CK
Pand, JHL
Sun, YF
Ng, FL
Tew, JW
Fan, W
PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 492 - 496
[3] Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints
Yoon, Jeong-Won
Noh, Bo-In
Kim, Bong-Kyun
Shur, Chang-Chae
Jung, Seung-Boo
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 486 (1-2) : 142 - 147
[4] Effect of Transient Current Bonding on Interfacial Reaction in the Sn-Ag-Cu Solder Joints
Yang J.
Han Y.
Xu L.
Cailiao Daobao/Materials Reports, 2022, 36 (01):
[5] Microstructure of interfacial reaction layer in Sn-Ag-Cu/electroless Ni (P) solder joint
Kang, Han-Byul
Bae, Jee-Hwan
Yoon, Jeong-Won
Jung, Seung-Boo
Park, Jongwoo
Yang, Cheol-Woong
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (09) : 1308 - 1312
[6] Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate
Adawiyah, M. A. Rabiatul
Azlina, O. Saliza
ADVANCES IN MATERIAL & PROCESSING TECHNOLOGIES CONFERENCE, 2017, 184 : 604 - 610
[7] Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
Zhang XiaoRui
Yuan ZhangFu
Zhao HongXin
Zang LiKun
Li JianQiang
CHINESE SCIENCE BULLETIN, 2010, 55 (09): : 797 - 801
[8] Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
ZHANG XiaoRui YUAN ZhangFu ZHAO HongXin ZANG LiKun LI JianQiang Department of Energy Resources Engineering College of Engineering Peking University Beijing China State Key Laboratory of Multiphase Complex System Institute of Process Engineering Chinese Academy of Sciences Beijing China
Chinese Science Bulletin, 2010, 55 (09) : 797 - 801
[9] The effect of CNT and Cu on interfacial intermetallic growth of Sn-Ag-Cu solder
Liyana, M. H. Nur
Hanim, M. A. Azmah
Sulaiman, Shamsuddin
Azlina, O. Saliza
1ST INTERNATIONAL POSTGRADUATE CONFERENCE ON MECHANICAL ENGINEERING (IPCME2018), 2019, 469
[10] Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
Chiang-Ming Chuang
Kwang-Lung Lin
Journal of Electronic Materials, 2003, 32 : 1426 - 1431

← 1 2 3 4 5 →