Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

被引：21
|
作者：
Zhang XiaoRui [1 ,2 ]
Yuan ZhangFu [1 ,2 ]
Zhao HongXin [2 ]
Zang LiKun [2 ]
Li JianQiang [2 ]
机构：
[1] Peking Univ, Coll Engn, Dept Energy & Resources Engn, Beijing 100871, Peoples R China
[2] Chinese Acad Sci, Inst Proc Engn, State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China
来源：
CHINESE SCIENCE BULLETIN | 2010年 / 55卷 / 09期
基金：
中国国家自然科学基金;
关键词：
contact angle; lead-free solder; sessile drop method; Sn-Ag-Cu; intermetallic compounds; LEAD-FREE SOLDERS; SESSILE DROP METHOD; SURFACE-TENSION; INTERMETALLIC COMPOUNDS; BI SOLDER; CREEP;
D O I：
10.1007/s11434-010-0056-z
中图分类号：
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号：
07 ; 0710 ; 09 ;
摘要：
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy's melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample's cross section. Intermetallic compounds of Cu6Sn5 and beta-Sn phase were found at the interface of Sn-Ag-Cu/Cu.
引用
收藏
页码：797 / 801
页数：5
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