Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

被引：0
|
作者：
Jicheng Gong
Paul P. Conway
Changqing Liu
Vadim V. Silberschmidt
机构：
[1] University of Oxford,Department of Materials
[2] Loughborough University,Wolfson School of Mechanical and Manufacturing Engineering
来源：
Journal of Electronic Materials | 2009年 / 38卷
关键词：
Lead-free solder; Sn-Ag-Cu; micromechanical testing; dislocations;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
To study the intragranular mechanical behavior of a Sn-Ag-Cu solder, a focused ion beam system was used to manufacture a notched microspecimen at a eutectic area within a grain. A low-speed tensile test was performed on the microspecimen using an Instron 5848 microtester at room temperature. The results show that, besides an obvious shearing deformation, a large number of subgrains are formed in the β-Sn matrix. Subgrain boundaries are composed of a large number of dislocations. Besides the heterogeneous deformation due to the notch, Ag3Sn intermetallic compounds influence the evolution path of subgrain boundaries.
引用
收藏
页码：2429 / 2435
页数：6
相关论文
共 50 条
  • [1] Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy
    Gong, Jicheng
    Conway, Paul P.
    Liu, Changqing
    Silberschmidt, Vadim V.
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (12) : 2429 - 2435
  • [2] Undercooling and Solidification Behavior of Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/UBM Joints
    Xu, Guang-Sui
    Zeng, Jing-Bo
    Zhou, Min-Bo
    Zhang, Xin-Ping
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 325 - 329
  • [3] Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
    Zhang XiaoRui
    Yuan ZhangFu
    Zhao HongXin
    Zang LiKun
    Li JianQiang
    CHINESE SCIENCE BULLETIN, 2010, 55 (09): : 797 - 801
  • [4] Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
    ZHANG XiaoRui YUAN ZhangFu ZHAO HongXin ZANG LiKun LI JianQiang Department of Energy Resources Engineering College of Engineering Peking University Beijing China State Key Laboratory of Multiphase Complex System Institute of Process Engineering Chinese Academy of Sciences Beijing China
    Chinese Science Bulletin, 2010, 55 (09) : 797 - 801
  • [5] Ultrasonic Modification of Sn-Ag-Cu Alloy Microstructure
    Belyakov, Sergey A.
    EDM 2008: INTERNATIONAL WORKSHOP AND TUTORIALS ON ELECTRON DEVICES AND MATERIALS, PROCEEDINGS, 2008, : 58 - 59
  • [6] Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticles
    Roshanghias, Ali
    Yakymovych, Andriy
    Bernardi, Johannes
    Ipser, Herbert
    NANOSCALE, 2015, 7 (13) : 5843 - 5851
  • [7] Electrodeposition of Sn-Ag-Cu Solder Alloy for Electronics Interconnection
    Qin, Yi
    Liu, Changqing
    Wilcox, G. D.
    Zhao, Kun
    Wang, Changhai
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 278 - +
  • [8] Compression Stress–Strain Behavior of Sn-Ag-Cu Solders
    Edwin P. Lopez
    Paul T. Vianco
    Jerome A. Rejent
    Carly George
    Alice Kilgo
    Journal of Electronic Materials, 2010, 39 : 97 - 104
  • [9] Nanoindentation Creep Behavior of Nanocomposite Sn-Ag-Cu Solders
    Roshanghias, A.
    Kokabi, A. H.
    Miyashita, Y.
    Mutoh, Y.
    Ihara, I.
    Fatt, R. G. Guan
    Madaah-Hosseini, H. R.
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (08) : 2057 - 2064
  • [10] Nanoindentation Creep Behavior of Nanocomposite Sn-Ag-Cu Solders
    A. Roshanghias
    A. H. Kokabi
    Y. Miyashita
    Y. Mutoh
    I. Ihara
    R. G. Guan Fatt
    H. R. Madaah-Hosseini
    Journal of Electronic Materials, 2012, 41 : 2057 - 2064
12345