Work of indentation methods for determining copper film hardness

被引：60

作者：

Beegan, D

Chowdhury, S

Laugier, MT ^{[1
]}

机构：

[1] Univ Limerick, Dept Phys, Limerick, Ireland

[2] Univ Limerick, Mat Surface Sci Inst, Limerick, Ireland

来源：

SURFACE & COATINGS TECHNOLOGY | 2005年 / 192卷 / 01期

关键词：

nanoindentation; atomic force microscopy; copper;

D O I：

10.1016/j.surfcoat.2004.02.003

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

We have investigated the indentation hardness of sputter deposited copper films on oxidised silicon substrates. The results were initially analysed by the Oliver and Pharr method. AFM imaging of the indenter revealed pile-up material at the edges of the indents, which needs to be accounted for in the hardness calculation. Thus, the hardness is recalculated by measurement of the actual areas and volume by AFM analysis and also by work of indentation methods. A comparison between the results obtained by these methods is made. (C) 2004 Elsevier B.V. All tights reserved.

引用

页码：57 / 63

页数：7

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