Wetting interaction between Sn-Zn-Ag solders and Cu

被引：70
|
作者：
Lin, KL [1 ]
Shih, CL [1 ]
机构：
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2003年 / 32卷 / 02期
关键词：
Pb-free solder; wetting; intermetallic compound; Sn-Zn-Ag;
D O I：
10.1007/s11664-003-0242-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The wetting interaction of Sn-(7.1-9)Zn-(0-3)Ag solders with Cu was investigated from 230degreesC to 300degreesC. The wetting time, wetting forces, and activation energy of the wetting reaction were studied. The wetting time decreases with increasing temperature and increases with Ag content. The wetting force exhibits a disproportional correlation to temperature rise, while no trend was observed with respect to Ag content. The wetting behavior was ascribed to the interaction between Cu and Zn. The AgZn3 compound was formed at the interface when the solder contains 0.3% Ag and above, while it was formed within the bulk solder at 2% Ag and above.
引用
收藏
页码：95 / 100
页数：6
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