Wetting interaction between Sn-Zn-Ag solders and Cu

被引：70
|
作者：
Lin, KL [1 ]
Shih, CL [1 ]
机构：
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2003年 / 32卷 / 02期
关键词：
Pb-free solder; wetting; intermetallic compound; Sn-Zn-Ag;
D O I：
10.1007/s11664-003-0242-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The wetting interaction of Sn-(7.1-9)Zn-(0-3)Ag solders with Cu was investigated from 230degreesC to 300degreesC. The wetting time, wetting forces, and activation energy of the wetting reaction were studied. The wetting time decreases with increasing temperature and increases with Ag content. The wetting force exhibits a disproportional correlation to temperature rise, while no trend was observed with respect to Ag content. The wetting behavior was ascribed to the interaction between Cu and Zn. The AgZn3 compound was formed at the interface when the solder contains 0.3% Ag and above, while it was formed within the bulk solder at 2% Ag and above.
引用
收藏
页码：95 / 100
页数：6
相关论文
共 50 条
  • [21] Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate
    Chang-Ho Yu
    Kwang-Lung Lin
    [J]. Journal of Materials Research, 2005, 20 : 1242 - 1249
  • [22] Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders
    Chang, C. C.
    Kao, C. R.
    [J]. 2007 INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 54 - 57
  • [23] Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys
    Song, JM
    Lin, KL
    [J]. JOURNAL OF MATERIALS RESEARCH, 2004, 19 (09) : 2719 - 2724
  • [24] Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys
    Song, JM
    Lin, KL
    [J]. JOURNAL OF MATERIALS RESEARCH, 2003, 18 (09) : 2060 - 2067
  • [25] Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions
    Przemysław Fima
    Władysław Gąsior
    Anna Sypień
    Zbigniew Moser
    [J]. Journal of Materials Science, 2010, 45 : 4339 - 4344
  • [26] Viscosities and wetting behaviors of Sn-Cu solders
    Zhao Ning
    Huang Ming-Liang
    Ma Hai-Tao
    Pan Xue-Min
    Liu Xiao-Ying
    [J]. ACTA PHYSICA SINICA, 2013, 62 (08)
  • [27] Characterization of the melting and wetting of Sn-Ag-X solders
    Bradley, E
    Hranisavljevic, J
    [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2001, 24 (04): : 255 - 260
  • [28] The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu
    Liu, NS
    Lin, KL
    [J]. SCRIPTA MATERIALIA, 2006, 54 (02) : 219 - 224
  • [29] Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate
    Yu, DQ
    Xie, HP
    Wang, L
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2004, 385 (1-2) : 119 - 125
  • [30] Characterization of the melting and wetting of Sn-Ag-X solders
    Bradley, E
    Hranisavljevic, J
    [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1443 - 1448
12345