Wetting interaction between Pb-free Sn-Zn series solders and Cu, Ag substrates

被引：0
|
作者：
Lin, KL [1 ]
Liu, PC [1 ]
Song, JM [1 ]
机构：
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
来源：
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This study investigated the wetting behaviour of Cu and Ag with pure Sn and several Sn-Zn solders, including Sn-9Zn (abbreviated as Sn-Zn), Sn-8.55Zn-0.5AI (abbreviated as Sn-Zn-Al), and Sn-8.55Zn-0.5Ag-0.1AI-0.5Ga (abbreviated as Sn-Zn-Ag-Al-Ga). Results show that Sn-Zn solders exhibit better wettability with both Cu and Ag than pure Sri. The primary interfacial intermetallics in Sn-Zn are (Ag,Cu)Zn rather than (Ag,Cu)Sn. By way of alloying modification, the Sn-Zn-Ag-Al-Ga alloy exhibits the greater wetting behaviour than other solders.
引用
收藏
页码：1310 / 1313
页数：4
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