Wafer-scale profile evolution of electrochemically deposited copper films

被引：7
|
作者：
Flake, J [1 ]
Solomentsev, Y
Cooper, J
Cooper, K
机构：
[1] Motorola Digital DNA Labs, Austin, TX 78721 USA
[2] AMD Motorola Alliance, Austin, TX 78721 USA
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2003年 / 150卷 / 04期
关键词：
D O I：
10.1149/1.1554723
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Wafer-scale profile evolution of electrochemically deposited copper films is experimentally studied and compared with theoretical predictions. The effects of ohmic potential drop, electrochemical current-voltage behavior at the metal/electrolyte interface, and local concentration variations are considered. Results show good agreement with experimental data over a wide range of total currents and times. (C) 2003 The Electrochemical Society.
引用
收藏
页码：C195 / C201
页数：7
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