Non-Destructive Evaluation of the Cutting Surface of Hardwood Finger Joints

被引:4
|
作者
Stolze, Hannes [1 ]
Gurnik, Michael [1 ]
Koddenberg, Tim [1 ]
Kroeger, Jonas [2 ]
Koehler, Robert [3 ]
Vioel, Wolfgang [3 ]
Militz, Holger [1 ]
机构
[1] Univ Goettingen, Fac Forest Sci & Forest Ecol, Wood Biol & Wood Prod, Buesgenweg 4, D-37077 Gottingen, Germany
[2] Univ Kassel, Inst Prod Technol & Logist, Dept Cutting & Joining Mfg Proc, Kurt Wolters Str 3, D-34125 Kassel, Germany
[3] Univ Appl Sci & Arts, Fac Engn & Hlth, Lab Laser & Plasma Technol, Von Ossietzky Str 99, D-37085 Gottingen, Germany
关键词
finger-jointing; hardwood; wood characterization; non-destructive evaluation; cutting surface; wettability; roughness; adhesive penetration; WOOD SURFACES; ROUGHNESS; WETTABILITY; ADHESION; STRENGTH;
D O I
10.3390/s22103855
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
In this study, the surface parameters wettability, roughness, and adhesive penetration, which are important for wood bonding, were investigated and evaluated utilizing non-destructive methods after different mechanical processing. For this purpose, beech and birch finger joints were prepared with different cutting combinations (three cutters with different sharpness levels and two feed rates) in an industrial process. Effects and interactions on the surface parameters resulting from the different cutting combinations were evaluated using three Full Factorial Designs. The various cutting parameters had a predominantly significant influence on the surface parameters. The effects and identified interactions highlight the complexity of the cutting surface and the importance of wood bonding. In this respect, a new finding is that with sharper cutters, higher contact angles of the adhesives occur. The methods (contact angle measurement, laser scanning microscopy, and brightfield microscopy) used were well suited to make effects visible and quantifiable, which can be of interest for the quality control of the wood processing industry. The results can help to better understand and evaluate the design of wood surfaces via machining and the bonding of hardwoods. Possibly the results can contribute to further standardizing the production of load-bearing hardwood finger joints and making them more efficient.
引用
收藏
页数:20
相关论文
共 50 条
  • [21] NON-DESTRUCTIVE TESTING OF ADHESIVE BONDED JOINTS.
    Schliekelmann, Rob J.
    Bonded Jt and Prep for Bonding, Presented at Oslo, Norw, Apr 2-3 1979, 1979, (102): : 1 - 8
  • [22] Applicability of Non-Destructive Examination to Iter TF Joints
    March, Stephen
    Bruzzone, Pierluigi
    Hamada, Kazuya
    Foussat, Arnaud
    Bonito-Oliva, Alessandro
    Cornelis, Marc
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2015, 25 (03)
  • [23] NON-DESTRUCTIVE MEASUREMENT OF RESIDUAL STRESSES IN WELDED JOINTS
    GUSHCHA, OI
    LEBEDEV, VK
    AUTOMATIC WELDING USSR, 1969, 22 (01): : 44 - &
  • [24] Non-destructive testing and inspection for welds and bonding joints
    Yoshikazu, Yokono
    Yosetsu Gakkai Shi/Journal of the Japan Welding Society, 2009, 78 (03): : 37 - 47
  • [25] Non-destructive characterization of bondlines in composite adhesive joints
    Mylavarapu, Phani
    Woldesenbet, Eyassu
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2006, 20 (07) : 647 - 660
  • [26] Non-destructive testing of joints in precast element structures
    Petersen, Claus Germann
    Recillas, Hugo D. Orozco
    CONCRETE SOLUTIONS, 2016, : 229 - 234
  • [27] Non-destructive testing of adhesively-bonded joints
    Adams, R.D.
    Drinkwater, B.W.
    International Journal of Materials and Product Technology, 1999, 14 (5-6): : 385 - 398
  • [28] Non-destructive characterization of bondlines in composite adhesive joints
    Mylavarapu, Phani
    Woldesenbet, Eyassu
    Journal of Adhesion Science and Technology, 2006, 20 (07): : 647 - 660
  • [29] Non-destructive testing of adhesively-bonded joints
    Adams, RD
    Drinkwater, BW
    INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, 1999, 14 (5-6): : 385 - 398
  • [30] Destructive and non-destructive evaluation of copper diffusion bonds
    Kumar, S. Suresh
    Ravisankar, B.
    JOURNAL OF MANUFACTURING PROCESSES, 2016, 23 : 13 - 20