Effect of Neutron Irradiation on High Voltage 4H-SiC Vertical JFET Characteristics: Characterization and Modeling

被引:11
|
作者
Popelka, S. [1 ]
Hazdra, P. [1 ]
Sharma, R. [1 ]
Zahlava, V. [1 ]
Vobecky, J. [1 ]
机构
[1] Czech Tech Univ, Dept Microelect, Prague 6, Czech Republic
关键词
Junction field effect transistor (JFET); neutrons; radiation effects; silicon carbide (SiC); SILICON-CARBIDE; 4H; DEFECTS; 3C;
D O I
10.1109/TNS.2014.2358957
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effect of neutron irradiation on commercial vertical high voltage normally-OFF SiC power N-JFETs was investigated. JFETs were irradiated with 1 MeV neutron equivalent fluences up to 4 x 10(14) cm(-2). Measurement showed that fast neutrons introduce deep levels acting mostly as deep acceptor centers. These centers gradually compensate lightly doped channel and drift regions of JFETs. As a result, characteristics are deteriorated, the JFET threshold voltage gradually increases and transconductance is lowered. At fluences higher than 4 x 10(14) cm(-2), the low doped n-regions are fully compensated and transistor loses its functionality. The 2D physicalmodel of JFET in ATLAS simulator was developed and calibrated including the neutron irradiation effects. Simulation showed a good agreement with experimental data. This confirmed that carrier removal in the channel and drift region by acceptors centers introduced by neutrons is a dominant reason of SiC JFET degradation.
引用
收藏
页码:3030 / 3036
页数:7
相关论文
共 50 条
  • [41] Polyimide Passivation Effect on High Voltage 4H-SiC PiN Diode Breakdown Voltage
    Diaham, Sombel
    Locatelli, Marie-Laure
    Lebey, Thierry
    Raynaud, Christophe
    Lazar, Mihai
    Vang, Heu
    Planson, Dominique
    SILICON CARBIDE AND RELATED MATERIALS 2008, 2009, 615-617 : 695 - 698
  • [42] Optimisation of a 4H-SiC enhancement mode power JFET for high temperature operation
    Bhatnagar, P
    Horsfall, AB
    Wright, NG
    Johnson, CM
    Vassilevski, KV
    O'Neill, AG
    SOLID-STATE ELECTRONICS, 2005, 49 (03) : 453 - 458
  • [43] Effects of Neutron Irradiation on the Static and Switching Characteristics of High-Voltage 4H-SiC p-type Gate Turn-off Thyristors
    Dong, Peng
    Cui, Yingxin
    Chen, Zhe
    Gu, Yunfei
    Zhou, Kun
    Deng, Shuairong
    Zhong, Le
    Zhang, Ying
    Li, Juntao
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (09) : 3917 - 3922
  • [44] Design and characterization of high-voltage 4H-SiC p-IGBTs
    Zhang, Qingchun
    Wang, Jun
    Jonas, Charlotte
    Callanan, Robert
    Sumakeris, Joseph J.
    Ryu, Sei-Hyung
    Das, Mrinal
    Agarwal, Anant
    Palmour, John
    Huang, Alex Q.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (08) : 1912 - 1919
  • [45] Influence of gamma-ray and neutron irradiation on injection characteristics of 4H-SiC pn structures
    Strel'chuk, AM
    Kalinina, EV
    Konstantinov, AO
    Hallen, A
    SILICON CARBIDE AND RELATED MATERIALS 2004, 2005, 483 : 993 - 996
  • [46] ELECTRON TRANSPORT CHARACTERISTICS OF 6H-SIC AND 4H-SIC FOR HIGH TEMPERATURE DEVICE MODELING
    Arabshahi, Hadi
    Rokn-Abadi, Mahmood Rezaee
    JOURNAL OF SCIENCE AND ARTS, 2010, (02): : 409 - 418
  • [47] Effect of Proton Irradiation on the Properties of High-Voltage Integrated 4H-SiC Schottky Diodes at Operating Temperatures
    Lebedev, A. A.
    Kozlovskii, V. V.
    Levinshtein, M. E.
    Malevskii, D. A.
    Oganesyan, G. A.
    SEMICONDUCTORS, 2023, 57 (02) : 125 - 129
  • [48] Effect of Proton Irradiation on the Properties of High-Voltage Integrated 4H-SiC Schottky Diodes at Operating Temperatures
    A. A. Lebedev
    V. V. Kozlovskii
    M. E. Levinshtein
    D. A. Malevskii
    G. A. Oganesyan
    Semiconductors, 2023, 57 : 125 - 129
  • [49] High-Temperature Reliability Assessment of 4H-SiC Vertical-Channel JFET Including Forward Bias Stress
    Cheng, Lin
    Mazzola, Michael S.
    Sheridan, David
    SILICON CARBIDE AND RELATED MATERIALS 2008, 2009, 615-617 : 723 - 726
  • [50] Neutron radiation effect on 4H-SiC MESFETs and SBDs
    张林
    张义门
    张玉明
    韩超
    半导体学报, 2010, 31 (11) : 29 - 32