Side-wall roughness in SOI rib waveguides fabricated by inductively coupled plasma reactive ion etching

被引:7
|
作者
Wang, Y [1 ]
Lin, Z [1 ]
Zhang, J [1 ]
Cheng, X [1 ]
Zhang, F [1 ]
机构
[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Ion Beam Lab, Shanghai 200050, Peoples R China
来源
APPLIED PHYSICS B-LASERS AND OPTICS | 2004年 / 79卷 / 07期
关键词
D O I
10.1007/s00340-004-1648-6
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
SOI rib waveguides were fabricated with vertical side walls using inductively coupled plasma reactive ion etching. The root-mean-square (rms) roughness of the side-wall surface was directly measured by atomic force microscopy. The rms roughness of the side-wall surface obtained by three-mask lithography is 28.73 nm, much higher than that of the one-mask-lithography SOI rib waveguide. The scattering loss induced from side-wall roughness is evaluated using Tien's theory, and is proportional to the square of the side-wall rms roughness. To reduce the rms roughness, hydrogen annealing was used to smooth the side-wall surface obtained by three-mask lithography. After hydrogen annealing, there is a significant drop in the rms roughness of the side-wall surface.
引用
收藏
页码:879 / 881
页数:3
相关论文
共 50 条
  • [41] Etch characteristics of FePt magnetic thin films using inductively coupled plasma reactive ion etching
    Kim, Eun Ho
    Bin Xiao, Yu
    Kong, Seon Mi
    Chung, Chee Won
    THIN SOLID FILMS, 2011, 519 (23) : 8223 - 8228
  • [42] Effect of CHF3 addition on reactive ion etching of aluminum using inductively coupled plasma
    Saito, Shuichi
    Sugita, Kazuyuki
    Tonotani, Junichi
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2005, 44 (5 A): : 2971 - 2975
  • [43] Etch characteristics of nickel oxide thin films using inductively coupled plasma reactive ion etching
    Cho, Han Na
    Min, Su Ryun
    Bae, Hyung Jin
    Lee, Jung Hyun
    Chung, Chee Won
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2008, 11 (02) : D23 - D26
  • [44] Tin removal from extreme ultraviolet collector optics by inductively coupled plasma reactive ion etching
    Shin, H.
    Srivastava, S. N.
    Ruzic, D. N.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2008, 26 (03): : 389 - 398
  • [45] Gas mixture influence on the reactive ion etching of InSb in an inductively coupled methane-hydrogen plasma
    Abautret, J.
    Evirgen, A.
    Perez, J. P.
    Laaroussi, Y.
    Cordat, A.
    Boulard, F.
    Christol, P.
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2015, 30 (06)
  • [46] Reactive ion etching of single crystal diamond by inductively coupled plasma: State of the art and catalog of recipes
    Toros, A.
    Kiss, M.
    Graziosi, T.
    Mi, S.
    Berrazouane, R.
    Naamoun, M.
    Plestina, J. Vukajlovic
    Gallo, P.
    Quack, N.
    DIAMOND AND RELATED MATERIALS, 2020, 108 (108)
  • [47] Benchmarking diamond surface preparation and fluorination via inductively coupled plasma-reactive ion etching
    Gray, Tia
    Zhang, Xiang
    Biswas, Abhijit
    Terlier, Tanguy
    Oliveira, Eliezer F.
    Puthirath, Anand B.
    Li, Chenxi
    Pieshkov, Tymofii S.
    Garratt, Elias J.
    Neupane, Mahesh R.
    Pate, Bradford B.
    Birdwell, A. Glen
    Ivanov, Tony G.
    Vajtai, Robert
    Ajayan, Pulickel M.
    CARBON, 2024, 228
  • [48] Effect of CHF3 addition on reactive ion etching of aluminum using inductively coupled plasma
    Saito, S
    Sugita, K
    Tonotani, J
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (5A): : 2971 - 2975
  • [49] Inductively coupled plasma reactive ion etching of ZnO using BCI3-based plasmas
    Kim, HK
    Bae, JW
    Kim, TK
    Kim, KK
    Seong, TY
    Adesida, I
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2003, 21 (04): : 1273 - 1277
  • [50] Device characteristics of AlGaAs/InGaAs HEMTs fabricated by inductively coupled plasma etching
    Lee, JH
    Yoon, HS
    Shim, JY
    Kim, HC
    THIN SOLID FILMS, 2003, 435 (1-2) : 139 - 144