Inductively coupled plasma reactive ion etching of ZnO using BCI3-based plasmas

被引:53
|
作者
Kim, HK [1 ]
Bae, JW
Kim, TK
Kim, KK
Seong, TY
Adesida, I
机构
[1] Univ Illinois, Micro & Nanotechnol Lab, Urbana, IL 61801 USA
[2] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
[3] K JIST, Dept Mat Sci & Engn, Kwangju 500712, South Korea
来源
关键词
D O I
10.1116/1.1575250
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Etching characteristics of ZnO are investigated by means of inductively coupled plasma (ICP) reactive ion etching in BCl3-based plasmas. Etch rates are studied as a function of BCl3/Cl-2/Ar chemistries, substrate temperature, ICP coil power, rf power, and working pressure. Surface profilometer, scanning electron microscopy, and atomic force microscopy are used to characterize etch rates. etch profiles, and the surface morphologies of etched samples. It is shown that the etch rate is determined by the BCl3 content in the plasma. Auger electron spectroscopy results demonstrate that the BCl3-based etching process produces negligible changes in the surface stoichiometry of ZnO. (C) 2003 American Vacuum Society.
引用
收藏
页码:1273 / 1277
页数:5
相关论文
共 50 条
  • [1] Inductively-coupled-plasma reactive ion etching of ZnO using BCl3-based plasmas and effect of the plasma treatment on Ti/Au ohmic contacts to ZnO
    Kim, HK
    Bae, JW
    Kim, KK
    Park, SJ
    Seong, TY
    Adesida, I
    THIN SOLID FILMS, 2004, 447 : 90 - 94
  • [2] Reactive ion etching of FePt using inductively coupled plasma
    Kanazawa, Tomomi
    Ono, Kohei
    Takenaka, Masato
    Yamazaki, Masashi
    Masuda, Kenichi
    Cho, Shiho
    Wakayama, Takayuki
    Takano, Fumiyoshi
    Akinaga, Hiro
    APPLIED SURFACE SCIENCE, 2008, 254 (23) : 7918 - 7920
  • [3] Inductively coupled plasma reactive ion etching of ZnO films in HBr/Ar plasma
    Min, Su Ryun
    Cho, Han Na
    Li, Yue Long
    Chung, Chee Won
    THIN SOLID FILMS, 2008, 516 (11) : 3521 - 3529
  • [4] Etching characteristics of LiNbO3 in reactive ion etching and inductively coupled plasma
    Ren, Z.
    Heard, P. J.
    Marshall, J. M.
    Thomas, P. A.
    Yu, S.
    JOURNAL OF APPLIED PHYSICS, 2008, 103 (03)
  • [5] Deep, vertical etching for GaAs using inductively coupled plasma/reactive ion etching
    Booker, Katherine
    Mayon, Yahuitl Osorio
    Jones, Christopher
    Stocks, Matthew
    Blakers, Andrew
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2020, 38 (01):
  • [6] Dry etching of ZnO using an inductively coupled plasma
    Lee, JM
    Chang, KM
    Kim, KK
    Choi, WK
    Park, SJ
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (01) : G1 - G3
  • [7] Inductively coupled plasma etching of ZnO
    Nordheden, Karen J.
    Dineen, Mark
    Welch, Colin
    ZINC OXIDE MATERIALS AND DEVICES II, 2007, 6474
  • [8] Inductively coupled plasma reactive ion etching of ZnO using C2F6 and NF3-based gas mixtures
    Lee, Gun-Kyo
    Moon, Jong-Ha
    Lee, Byung-Teak
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2006, 21 (07) : 971 - 974
  • [9] Effect of CHF3 addition on reactive ion etching of aluminum using inductively coupled plasma
    Saito, Shuichi
    Sugita, Kazuyuki
    Tonotani, Junichi
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2005, 44 (5 A): : 2971 - 2975
  • [10] Observation of inverse reactive ion etching lag for silicon dioxide etching in inductively coupled plasmas
    Doemling, MF
    Rueger, NR
    Oehrlein, GS
    APPLIED PHYSICS LETTERS, 1996, 68 (01) : 10 - 12