High-Performance Si Nanowire Transistors on Fully Si Bulk Substrate From Top-Down Approach: Simulation and Fabrication

被引:11
|
作者
Zhuge, Jing [1 ]
Tian, Yu [1 ]
Wang, Runsheng [1 ]
Huang, Ru [1 ]
Wang, Yiqun [1 ]
Chen, Baoqin [2 ]
Liu, Jia [1 ]
Zhang, Xing [1 ]
Wang, Yangyuan [1 ]
机构
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
[2] Chinese Acad Sci IMECAS, Inst Microelect, Beijing 100029, Peoples R China
基金
中国国家自然科学基金;
关键词
CMOS; scaling; self-heating effects; silicon (Si) nanowire transistor (SNWT); THERMAL-CONDUCTIVITY; MOSFETS;
D O I
10.1109/TNANO.2009.2022537
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new method to fabricate high-performance gate-all-around silicon (Si) nanowire transistors (SNWTs) based on fully Si bulk (FSB) substrate is proposed and demonstrated by both simulation and experiments in this paper. Due to the large fan-out and deep junction of Si source/drain (S/D) region connecting with the bulk substrate, the FSB SNWTs can effectively alleviate the self-heating effects with technology scaling. Thermal behavior of multiwire SNWTs is investigated and FSB SNWTs show superior self-heating immunity to SNWTs based on Si-on-insulator (SOI) substrate (SOI SNWTs). In addition, the bottom parasitic transistor can be well suppressed in this structure. Although FSB SNWTs have larger gate parasitic capacitance, the CV/I is found to be comparable to the SOI SNWTs. With self-aligned, fully epi-free compatible CMOS processes, this new architecture was successfully fabricated, which exhibit high ON-OFF current ratio of 2.6 x 10(8) due to better heat dissipation and low S/D resistance realized in this structure.
引用
收藏
页码:114 / 122
页数:9
相关论文
共 50 条
  • [1] Top-Down Fabrication of Epitaxial SiGe/Si Multi-(Core/Shell) p-FET Nanowire Transistors
    Barraud, Sylvain
    Hartmann, Jean-Michel
    Maffini-Alvaro, Virginie
    Tosti, Lucie
    Delaye, Vincent
    Lafond, Dominique
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2014, 61 (04) : 953 - 956
  • [2] Si, SiGe Nanowire Devices by Top-Down Technology and Their Applications
    Singh, Navab
    Buddharaju, Kavitha D.
    Manhas, S. K.
    Agarwal, A.
    Rustagi, Subhash C.
    Lo, G. Q.
    Balasubramanian, N.
    Kwong, Dim-Lee
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (11) : 3107 - 3118
  • [3] High-performance poly-Si nanowire NMOS transistors
    Lin, Horng-Chih
    Su, Chun-Jung
    [J]. IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2007, 6 (02) : 206 - 212
  • [4] A Top-down Approach to Fabrication of High Quality Vertical Heterostructure Nanowire Arrays
    Wang, Hua
    Sun, Minghua
    Ding, Kang
    Hill, Martin T.
    Ning, Cun-Zheng
    [J]. NANO LETTERS, 2011, 11 (04) : 1646 - 1650
  • [5] Investigation of oxidation-induced strain in a top-down Si nanowire platform
    Najmzadeh, M.
    Bouvet, D.
    Dobrosz, P.
    Olsen, S.
    Ionescu, A. M.
    [J]. MICROELECTRONIC ENGINEERING, 2009, 86 (7-9) : 1961 - 1964
  • [6] Ge/Si nanowire heterostructures as high-performance field-effect transistors
    Xiang, Jie
    Lu, Wei
    Hu, Yongjie
    Wu, Yue
    Yan, Hao
    Lieber, Charles M.
    [J]. NATURE, 2006, 441 (7092) : 489 - 493
  • [7] Ge/Si nanowire heterostructures as high-performance field-effect transistors
    Jie Xiang
    Wei Lu
    Yongjie Hu
    Yue Wu
    Hao Yan
    Charles M. Lieber
    [J]. Nature, 2006, 441 : 489 - 493
  • [8] High-performance twin silicon nanowire MOSFET (TSNWFET) on bulk Si wafer
    Suk, Sung Dae
    Yeo, Kyoung Hwan
    Cho, Keun Hwi
    Li, Ming
    Yeoh, Yuri Young
    Lee, Sung-Young
    Kim, Sung Min
    Yoon, Eun Jung
    Kim, Min Sang
    Oh, Chang Woo
    Kim, Sung Hwan
    Kim, Dong-Won
    Park, Donggun
    [J]. IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2008, 7 (02) : 181 - 184
  • [9] Vertical Si nanowire with ultra-high-aspect-ratio by combined top-down processing technique
    Jun Nakamura
    Kohei Higuchi
    Kazusuke Maenaka
    [J]. Microsystem Technologies, 2013, 19 : 433 - 438
  • [10] Vertical Si nanowire with ultra-high-aspect-ratio by combined top-down processing technique
    Nakamura, Jun
    Higuchi, Kohei
    Maenaka, Kazusuke
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (03): : 433 - 438