High-Performance Si Nanowire Transistors on Fully Si Bulk Substrate From Top-Down Approach: Simulation and Fabrication

被引:11
|
作者
Zhuge, Jing [1 ]
Tian, Yu [1 ]
Wang, Runsheng [1 ]
Huang, Ru [1 ]
Wang, Yiqun [1 ]
Chen, Baoqin [2 ]
Liu, Jia [1 ]
Zhang, Xing [1 ]
Wang, Yangyuan [1 ]
机构
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
[2] Chinese Acad Sci IMECAS, Inst Microelect, Beijing 100029, Peoples R China
基金
中国国家自然科学基金;
关键词
CMOS; scaling; self-heating effects; silicon (Si) nanowire transistor (SNWT); THERMAL-CONDUCTIVITY; MOSFETS;
D O I
10.1109/TNANO.2009.2022537
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new method to fabricate high-performance gate-all-around silicon (Si) nanowire transistors (SNWTs) based on fully Si bulk (FSB) substrate is proposed and demonstrated by both simulation and experiments in this paper. Due to the large fan-out and deep junction of Si source/drain (S/D) region connecting with the bulk substrate, the FSB SNWTs can effectively alleviate the self-heating effects with technology scaling. Thermal behavior of multiwire SNWTs is investigated and FSB SNWTs show superior self-heating immunity to SNWTs based on Si-on-insulator (SOI) substrate (SOI SNWTs). In addition, the bottom parasitic transistor can be well suppressed in this structure. Although FSB SNWTs have larger gate parasitic capacitance, the CV/I is found to be comparable to the SOI SNWTs. With self-aligned, fully epi-free compatible CMOS processes, this new architecture was successfully fabricated, which exhibit high ON-OFF current ratio of 2.6 x 10(8) due to better heat dissipation and low S/D resistance realized in this structure.
引用
收藏
页码:114 / 122
页数:9
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