AN EFFICIENT CERTIFICATION APPROACH FOR NEW SN-AG-CU SOLDER ALLOY

被引：1
|
作者：
Masicat, Josephine [1 ]
Kumar, Chetan [2 ]
Nuda, Mitzi [1 ]
机构：
[1] Intel Technol Philippines Inc, Gateway Business Pk, Cavite 4107, Philippines
[2] Intel Corp, Chandler, AZ 85248 USA
来源：
2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL | 2007年
关键词：
SAC; solder alloy; solderjoint reliability;
D O I：
10.1109/RELPHY.2007.369952
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This poster presentation will showcase the certification methodologies employed for Intel's cellular handheld products in qualifying the Sn-Ag-Cu solder alloy, SAC105, on wire bonded packages. SAC 105 which contains 98.5% tin, 1.0% silver and 0.5% copper was identified as another viable solution to enhance package solder joint reliability performance.
引用
收藏
页码：564 / +
页数：2
相关论文
共 50 条
  • [1] Electrodeposition of Sn-Ag-Cu Solder Alloy for Electronics Interconnection
    Qin, Yi
    Liu, Changqing
    Wilcox, G. D.
    Zhao, Kun
    Wang, Changhai
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 278 - +
  • [2] Size Effect on the Intermetallic Compound Coalescence in Sn-Ag-Cu Solder and Sn-Ag-Cu/Cu Solder Joints
    Zhou Min-Bo
    Ma Xiao
    Zhang Xin-Ping
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 248 - 253
  • [3] Prediction of Phase Formation in Nanoscale Sn-Ag-Cu Solder Alloy
    Wu, Min
    Lv, Bailin
    JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (01) : 38 - 43
  • [4] Wettability of Carbon Nanotubes with Molten Sn-Ag-Cu Solder Alloy
    Chantaramanee, Suchart
    Wisutmethangoon, Sirikul
    Sikong, Lek
    Plookphol, Thawatchai
    ADVANCED MATERIALS DESIGN AND MECHANICS II, 2013, 372 : 136 - +
  • [5] Effect of Different Aging Times on Sn-Ag-Cu Solder Alloy
    Efzan, Ervina M. N.
    Norfarhani, Siti, I
    TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2015, 16 (03) : 112 - 116
  • [6] Prediction of Phase Formation in Nanoscale Sn-Ag-Cu Solder Alloy
    Min Wu
    Bailin Lv
    Journal of Electronic Materials, 2016, 45 : 38 - 43
  • [7] The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure
    Zribi, A
    Clark, A
    Zavalij, L
    Borgesen, P
    Cotts, EJ
    JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1157 - 1164
  • [8] The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure
    A. Zribi
    A. Clark
    L. Zavalij
    P. Borgesen
    E. J. Cotts
    Journal of Electronic Materials, 2001, 30 : 1157 - 1164
  • [9] Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
    Zhang XiaoRui
    Yuan ZhangFu
    Zhao HongXin
    Zang LiKun
    Li JianQiang
    CHINESE SCIENCE BULLETIN, 2010, 55 (09): : 797 - 801
  • [10] Undercooling and Solidification Behavior of Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/UBM Joints
    Xu, Guang-Sui
    Zeng, Jing-Bo
    Zhou, Min-Bo
    Zhang, Xin-Ping
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 325 - 329
12345