AN EFFICIENT CERTIFICATION APPROACH FOR NEW SN-AG-CU SOLDER ALLOY

被引：1
|
作者：
Masicat, Josephine [1 ]
Kumar, Chetan [2 ]
Nuda, Mitzi [1 ]
机构：
[1] Intel Technol Philippines Inc, Gateway Business Pk, Cavite 4107, Philippines
[2] Intel Corp, Chandler, AZ 85248 USA
来源：
2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL | 2007年
关键词：
SAC; solder alloy; solderjoint reliability;
D O I：
10.1109/RELPHY.2007.369952
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This poster presentation will showcase the certification methodologies employed for Intel's cellular handheld products in qualifying the Sn-Ag-Cu solder alloy, SAC105, on wire bonded packages. SAC 105 which contains 98.5% tin, 1.0% silver and 0.5% copper was identified as another viable solution to enhance package solder joint reliability performance.
引用
收藏
页码：564 / +
页数：2
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