Effect of Bis-(3-sulfopropyl) Disulfide and Chloride Ions on the Localized Electrochemical Deposition of Copper Microstructures

Micrometer copper columns were fabricated using localized electrochemical deposition (LECD) with and without deploying bis-(3-sulfopropyl) disulfide (SPS) and chloride ion (Cl-). In addition to the deposition rate, surface morphology and mechanical properties of deposited copper micro columns were influenced by additives in electrolyte solution. It was found the synergy effect of SPS and Cl-played a key role in determining the morphology and mechanical property of deposited micro structures. In particular, low concentration of SPS promoted a smoother surface, while high concentration of SPS accelerated the deposition process of micro structures with decreased hardness and Young's modulus as well as rough surface morphologies. The potential mechanism on experimental results was discussed on the basis of fundamental chemical reactions in LECD. (C) 2017 The Electrochemical Society. All rights reserved.