MEMS modular packaging and interfaces

被引：9

作者：

Schuenemann, M ^{[1
]}

Jam, KA ^{[1
]}

Grosser, V ^{[1
]}

Leutenbauer, R ^{[1
]}

Bauer, G ^{[1
]}

Schaefer, W ^{[1
]}

Reichl, H ^{[1
]}

机构：

[1] Fraunhofer Inst Mfg Engn & Automat IPA, D-70569 Stuttgart, Germany

来源：

50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS | 2000年

关键词：

D O I：

10.1109/ECTC.2000.853232

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Many industrial branches other than automotive industry may benefit from MEMS technology. Most of them require custom-designed MEMS in mid-scale volumes, which are at present not available at acceptable costs. A modular MEMS packaging and interface concept may contribute to less costly solutions with faster time to market. A 3D stackable packaging concept, the Top-Bottom Ball Grid Array TB-BGA, which includes electric, fluidic, optic, and communication interfaces, is proposed. Several realization technologies (LTCC, 3D-BGA, StackPack) as well as first applications are discussed.

引用

页码：681 / 688

页数：6

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