Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications

被引：13

作者：

Lee, Byung-Suk ^{[1
]}

Lee, Chang-Woo ^{[1
]}

Yoon, Jeong-Won ^{[1
]}

机构：

[1] Korea Inst Ind Technol KITECH, Microjoining Ctr, 156 Gaetbeol Ro, Inchon 406840, South Korea

来源：

SURFACE AND INTERFACE ANALYSIS | 2016年 / 48卷 / 07期

关键词：

power electronics; interfacial reaction; intermetallic compound (IMC); Sn-3; 0Ag-0; 5Cu solder; Au-20Sn solder; SOLDER JOINTS; RELIABILITY; STATE;

D O I：

10.1002/sia.5998

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A comparative study of Sn-3.0Ag-0.5Cu (SAC305) and Au-20Sn solders as die-attach materials for high-temperature power electronic applications was performed. The solid-state interfacial reactions of SAC305 and Au-20Sn solders with a Ni-plated Si chip and a direct-bonded-copper substrate, as well as the growth of interfacial intermetallic compound layers and interfacial stability, were investigated and compared during aging at 150 and 200 degrees C for up to 2000h. The SAC305 solder exhibited a higher interfacial intermetallic compound growth rate and a higher consumption rate of the Ni layer than the Au-20Sn solder. The Au-20Sn solder had a superior interfacial stability for high-temperature power electronic applications. Copyright (c) 2016 John Wiley & Sons, Ltd.

引用

页码：493 / 497

页数：5

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