Smooth and anisotropic dry etching of InGaAlAs using Cl2/N2 ECR plasma

被引:0
|
作者
Uchiyama, H [1 ]
Shinoda, K [1 ]
Sato, H [1 ]
Taike, A [1 ]
Taniguchi, T [1 ]
Tsuji, S [1 ]
机构
[1] Hitachi Ltd, Cent Res Lab, Kokubunji, Tokyo 1858601, Japan
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We developed a dry etching process for fabricating InGaAlAs laser mesa stripes and used it to fabricate an InGaAlAs-BH laser. We used optimized Cl-2/N-2 ECR plasma for the etching of an InGaAlAs laser multilayer structure. Use of this Cl-2/N-2 ECR plasma resulted in a uniform etching rate and resulted in an anisotropic etching by a nitrified side-protection mechanism. This smooth and anisotropic dry etching thus produced a well-matched interface between the etched surface and the semi-insulated Fe-InP regrown surface. The fabricated InGaAlAs-BH laser showed the stable operation at 85degreesC.
引用
收藏
页码:468 / 471
页数:4
相关论文
共 50 条
  • [31] Dry etching of deep Si trenches for released resonators in a Cl2 plasma
    Weigold, JW
    Juan, WH
    Pang, SW
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (05) : 1767 - 1771
  • [32] Vertical and smooth etching of InP by Cl2/Xe inductively coupled plasma
    Matsutani, Akihiro
    Ohtsuki, Hideo
    Koyama, Fumio
    Iga, Kenichi
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1999, 38 (7 A): : 4260 - 4261
  • [33] ANISOTROPIC ETCHING OF AL BY A DIRECTED CL2 FLUX
    EFREMOW, NN
    GEIS, MW
    MOUNTAIN, RW
    LINCOLN, GA
    RANDALL, JN
    ECONOMOU, NP
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1986, 4 (01): : 337 - 340
  • [34] Hydration of N2 and Cl2 molecules
    Galashev, AE
    Pozharskaya, GI
    Chukanov, VN
    RUSSIAN JOURNAL OF GENERAL CHEMISTRY, 2003, 73 (06) : 833 - 837
  • [35] Vertical and smooth etching of InP by Cl2/Xe inductively coupled plasma
    Matsutani, A
    Ohtsuki, H
    Koyama, F
    Iga, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (7A): : 4260 - 4261
  • [36] Dry etching of germanium using inductively coupled Ar/CCl2F2/Cl2 plasma
    Taek Sung Kim
    Sang-Sik Choi
    Mi Im Shin
    Tae Soo Jeong
    Sukil Kang
    Chel-Jong Choi
    Kyu-Hwan Shim
    Electronic Materials Letters, 2010, 6 : 35 - 39
  • [37] Dry Etching of Germanium Using Inductively Coupled Ar/CCl2F2/Cl2 Plasma
    Kim, Taek Sung
    Choi, Sang-Sik
    Shin, Mi Im
    Jeong, Tae Soo
    Kang, Sukil
    Choi, Chel-Jong
    Shim, Kyu-Hwan
    ELECTRONIC MATERIALS LETTERS, 2010, 6 (01) : 35 - 39
  • [38] Comparative study of Cl2, Cl2/O2, and Cl2/N2 inductively coupled plasma processes for etching of high-aspect-ratio photonic-crystal holes in InP
    Carlstrom, C. F.
    van der Heijden, R.
    Andriesse, M. S. P.
    Karouta, F.
    van der Heijden, R. W.
    van der Drift, E.
    Salemink, H. W. M.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2008, 26 (05): : 1675 - 1683
  • [39] Inductively coupled Cl2/N2 plasma:: Experimental investigation and modeling
    Kim, GH
    Efremov, AM
    Kim, DP
    Kim, CI
    MICROELECTRONIC ENGINEERING, 2005, 81 (01) : 96 - 105
  • [40] Low-temperature dry etching of InP by inductively coupled plasma using HI/Cl2
    Matsutani, A., 1600, Japan Society of Applied Physics (42):