Creep failure mechanism and life prediction of lead-free solder joint

被引：5
|
作者：
Zhu, Yongxin [1 ]
Li, Xiaoyan [1 ]
Gao, Ruiting [1 ]
机构：
[1] Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100024, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2015年 / 26卷 / 01期
基金：
中国国家自然科学基金;
关键词：
SN-3.5AG; ALLOY; BEHAVIOR; RUPTURE; MICROSTRUCTURE; FRACTURE; STRAIN; TIME;
D O I：
10.1007/s10854-014-2394-0
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The reliability of solder joints in electronic products has received a lot of concern. The creep behavior is an important property for lead-free solder. In this research, creep tests were conducted to the Sn3.0Ag0.5Cu solder joints. Creep failure mechanism was analyzed and creep life was evaluated based on the Monkman-Grant and Larson-Miller parameter model. The results show that separation is easy to take place at dendrite grain boundaries. Creep cavity initiates at triple junctions of dendrite grains in solder matrix near the intermetallic compound layer. The creep fracture morphology at low temperature and high stress comprises three regions: the shear plane, shear lip and the instantaneous rupture zone. However, the shear plane region is disappeared with increasing the temperature and decreasing the stress. The rupture surface is characterized by the shear lip and inter-granular failure morphology. The Monkman-Grant equation and Larson-Miller parameter model can be used to predict the solder joint creep life.
引用
收藏
页码：267 / 272
页数：6
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