DELPHI style compact modeling of stacked die packages

被引：5
|
作者：
Poppe, Andras [1 ,2 ]
Farkas, Gabor [2 ]
Parry, John [3 ]
Szabo, Peter [2 ]
Rencz, Marta [1 ,2 ]
Szekely, Vladimir [1 ]
机构：
[1] Budapest Univ Technol & Econ, Dept Elect Devices, Budapest, Hungary
[2] MicReD Ltd, Budapest, Hungary
[3] Flomerics Ltd, Surrey, England
来源：
TWENTY-THIRD ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2007 | 2007年
基金：
匈牙利科学研究基金会;
关键词：
stacked die packages; DELPHI models; thennal transient testing; structure functions;
D O I：
10.1109/STHERM.2007.352431
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Multi-die packages with vertical (stacked) arrangement became popular in many application fields, necessitating appropriate thermal measurement and modeling techniques. In this study we present our attempt to yield boundary condition independent models of stacked die pack-ages that reflect phenomena experienced by measurements. In our approach we propose an extension of the DELPHI model topology (accounting for multiple junctions). We also tried to extract most of the input data for model generation directly from thermal transient measurement results by the application of structure functions and by using electronically variable thermal resistances ap-plied as boundary conditions during tests.
引用
收藏
页码：248 / +
页数：2
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