Effect of Ag Content on the Microstructure and Crystallization of Coupled Eutectic Growth in Directionally Solidified Al-Cu-Ag Alloys

被引:7
|
作者
Du, Dafan [1 ]
Fautrelle, Yves [2 ]
Dong, Anping [1 ]
Shu, Da [1 ]
Zhu, Guoliang [1 ]
Sun, Baode [1 ]
Li, Xi [2 ,3 ]
机构
[1] Shanghai Jiao Tong Univ, Shanghai Key Lab Adv High Temp Mat & Precis Formi, BP 75, Shanghai 200240, Peoples R China
[2] PHELMA, CNRS, G INP, SIMAP EPM Madylam, F-38402 St Martin Dheres, France
[3] Shanghai Univ, State Key Lab Adv Special Steel, Shanghai 200072, Peoples R China
基金
中国博士后科学基金; 中国国家自然科学基金;
关键词
PLANAR INTERFACE; STABILITY; SIMULATIONS; ENERGIES; LAMELLAR;
D O I
10.1007/s11661-018-4799-5
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A series of coupled eutectic growths along the univariant eutectic groove in the ternary Al-Cu-Ag alloy was studied to investigate the effect of Ag on the microstructure and crystallization of directionally solidified Al-Cu-Ag alloys. The results indicated that the eutectic morphology and orientation relationship (OR) between eutectic phases were modified as the Ag content in the Al-Cu-Ag alloys increased. At a lower growth velocity (R <= 1 mu m/s), a banded structure formed and the interlamellar spacing decreased with the increasing Ag content. At a higher growth velocity (R >= 3 mu m/s), the eutectic cell spacing decreased with increasing Ag content. Increasing the Ag content in the Al-Cu-Ag alloys enhanced the enrichment of the Ag solute in the liquid ahead of the quenched liquid/solid interface. In addition, increasing the Ag content in the Al-Cu-Ag alloys promoted the transformation from a "Beta 6" OR to an "Alpha 4" OR between eutectic phases. Modifications of the eutectic morphology and the OR during directional solidification were attributed to the enrichment of Ag content at the solid/liquid interface and the changes in the interfacial energy due to the increase in Ag solubility in the alpha-Al phase. (C) The Minerals, Metals & Materials Society and ASM International 2018
引用
收藏
页码:4735 / 4747
页数:13
相关论文
共 50 条
  • [41] The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn-3.5Ag eutectic solder
    Sahin, Mevlut
    Cadirli, Emin
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (02) : 484 - 492
  • [42] STRENGTHENING MECHANISMS IN DIRECTIONALLY SOLIDIFIED AND FINE GRAINED SUPERPLASTIC AG-CU EUTECTIC
    CLINE, HE
    LEE, D
    JOURNAL OF METALS, 1969, 21 (03): : A84 - &
  • [43] Directionally Solidified Al-Cu-Si-Fe Quaternary Eutectic Alloys
    Buyuk, U.
    Engin, S.
    Kaya, H.
    Cadirli, E.
    Marasli, N.
    PHYSICS OF METALS AND METALLOGRAPHY, 2020, 121 (01): : 78 - 83
  • [44] OBSERVATION OF CUTTING DEFORMATION ZONE OF DIRECTIONALLY SOLIDIFIED AG-CU EUTECTIC ALLOY
    HASEGAWA, Y
    HANASAKI, S
    YASUTOMI, M
    KINOSHITA, K
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1977, 41 (07) : 711 - 717
  • [45] Two-phase planar and regular lamellar coupled growth along the univariant eutectic reaction in ternary alloys: An analytical approach and application to the Al-Cu-Ag system
    De Wilde, J
    Froyen, L
    Witusiewicz, VT
    Hecht, U
    JOURNAL OF APPLIED PHYSICS, 2005, 97 (11)
  • [46] Effect of Mg Content on Microstructure and Mechanical Properties of Al-Cu-Mg-Ag Alloys
    Duan Anjing
    Liu Zhiyi
    Xu Jing
    Bai Song
    Fang Tianwen
    RARE METAL MATERIALS AND ENGINEERING, 2010, 39 : 52 - 55
  • [47] GROWTH OF INTERDENDRITIC EUTECTIC IN DIRECTIONALLY SOLIDIFIED Al-Si ALLOYS.
    Grugel, R.
    Kurz, W.
    Metallurgical transactions. A, Physical metallurgy and materials science, 1987, 18 A (06): : 1137 - 1142
  • [48] Microstructure and Crystallization Evolution of Directionally Solidified Al-Cu-Si Alloys With the Assistance of a Static Magnetic Field
    Du, Dafan
    Dong, Anping
    Shu, Da
    Zhu, Guoliang
    Sun, Baode
    Li, Xi
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2022, 53 (08): : 3166 - 3178
  • [49] MICROSTRUCTURE OF RAPIDLY SOLIDIFIED EUTECTIC AND HYPEREUTECTIC AL-CU ALLOYS
    KIM, WT
    CANTOR, B
    KIM, TH
    INTERNATIONAL JOURNAL OF RAPID SOLIDIFICATION, 1990, 5 (04): : 251 - 276
  • [50] Unconstrained Growth along Ternary Eutectic Solidification Path in Al-Cu-Ag Alloy: Analysis of Microgravity Experiment
    Ebzeeva, Svetlana
    Froyen, Ludo
    TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 2007, 60 (2-3) : 207 - 212