Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures

被引：4
|
作者：
Yang, Dong [1 ]
Zhang, Xumeng [1 ]
Zhu, Jianguo [1 ]
机构：
[1] Jiangsu Univ, Fac Civil Engn & Mech, Zhenjiang 212013, Jiangsu, Peoples R China
来源：
SURFACES | 2021年 / 4卷 / 01期
关键词：
thin film; curvature measurement; stress; digital image correlation method; THIN; EVOLUTION; FILMS;
D O I：
10.3390/surfaces4010011
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney's formula. A Ni film electroplated on a H62Cu plate is used to verify the proposed method. The full fields of nonuniform thin-film stresses are obtained in a room temperature to high-temperature environment of 200 degrees C, which can be potentially extended to higher temperatures. These results provide a fundamental approach to understanding thin-film stresses and a feasible measurement method for high temperature.
引用
收藏
页码：89 / 96
页数：8
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