Microfluidic Cooling for 3D-IC with 3D Printing Package

被引：2
|
作者：
Han, Jun-Han [1 ]
Torres-Castro, Karina [1 ]
West, Robert E. [1 ]
Varhue, Walter [1 ]
Swami, Nathan [1 ]
Stan, Mircea [1 ]
机构：
[1] Univ Virginia, Elect & Comp Engn Dept, Charlottesville, VA 22904 USA
来源：
2019 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2019年
关键词：
microchannel; 3D-IC; cooling; 3D-printing; IC package;
D O I：
10.1109/S3S46989.2019.9320506
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Microchannel cooling method for stacked 3D-IC has process and cost issues. The proposed method, the thermal fluid chamber, exploits the gap between the upper and lower stacks. The method advantages are achieving controllable coolant flow and low-cost process. The microfluidic cooling system is composed of a thermal test chip, thermal test board, 3D printing package, and microfluidic apparatus. The thermal test chip with C4 micro-bumps is attached on the test board. The thermal generator and sensor in the chip are operated by the test board. The microfluidic chamber of 68 mu m thick is integrated between the chip and board. Thermal sensing and microfluidic tests demonstrate the validity of the thermal fluidic chamber.
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页数：3
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