DEVELOPMENT OF WAFER PROBE TESTING METHOD AND FEM SIMULATION MODEL

被引：0

作者：

Liu, D. S. ^{[1
]}

Chang, C. M. ^{[1
]}

Cheng, K. L. ^{[1
]}

Liu, John ^{[2
]}

Ho, S. C. ^{[2
]}

Tsai, H. Y. ^{[2
]}

机构：

[1] Natl Chung Cheng Univ, Dept Mech Engn, 160 San Hsing, Chiayi 621, Taiwan

[2] ChipMOS Technol Inc, Tainan, Taiwan

来源：

IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE | 2009年

关键词：

DESIGN; CARD;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Prober testers have been widely used by the semiconductor industry to determine whether the individual Integrated Circuits (IC) meet specifications of design. In this paper, probe contact tests are developed with different testing overdrive distance by using a micro-force tester. The probe tests are subsequently applied to a single tungsten needle probe to examine the relationships between contact force and scrub mark size on aluminum pads at various overdrive levels. A FE base simulation model was built and the simulation results were compared with testing output. The changing of the friction coefficient between pad and needle were studied, the results shown that it might be a key factor to control the scrubbing mark size

引用

页码：455 / +

页数：2

共 50 条

[31] FEM simulation of friction testing method based on combined forward rod-backward can extrusion
Nakamura, Tamotsu
Bay, Niels
Zhang, Zhi-Liang
Journal of Tribology, 1997, 119 (03): : 501 - 506
[32] FEM simulation of friction testing method based on combined forward rod-backward can extrusion
Nakamura, T
Bay, N
Zhang, ZL
JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME, 1997, 119 (03): : 501 - 506
[33] Simulation Research on Workshop Control Strategy in Semiconductor Wafer Probe Area
Zhang Tie-Zhu
Wang Yue-Peng
2008 ISECS INTERNATIONAL COLLOQUIUM ON COMPUTING, COMMUNICATION, CONTROL, AND MANAGEMENT, VOL 2, PROCEEDINGS, 2008, : 224 - +
[34] FEM simulation of TBC failure in a model system
Seiler, P.
Baeker, M.
Beck, T.
Schweda, M.
Roesler, J.
15TH INTERNATIONAL CONFERENCE ON THE STRENGTH OF MATERIALS (ICSMA-15), 2010, 240
[35] Simulation of Probe Misalignment Effects during RF On-Wafer Probing
von Kleist-Retzow, F. T.
Haenssler, C.
Fatikow, Sergej
2016 41ST INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ), 2016,
[36] Design, testing, and FEM simulation of interlaced fiber composite structures
Akkus, N.
Verchery, G.
Kawahara, M.
Genc, G.
COMPOSITE STRUCTURES, 2009, 88 (04) : 629 - 635
[37] Air Conditioning Stall Phenomenon - Testing, Model Development, and Simulation
Irminger, Philip
Rizy, D. Tom
Li, Huijuan
Smith, Travis
Rice, Keith
Li, Fangxing
Adhikari, Sarina
2012 IEEE PES TRANSMISSION AND DISTRIBUTION CONFERENCE AND EXPOSITION (T&D), 2012,
[38] DEVELOPMENT AND TESTING OF AN AGRICULTURAL LAND DRAINAGE SIMULATION MODEL.
Madramootoo, C.A.
Broughton, R.S.
Prasher, S.O.
Peyrow, F.
Computers and Electronics in Agriculture, 1987, 2 (01) : 15 - 30
[39] Moire Method for Nanoprecision Wafer-to-Wafer Alignment: Theory, Simulation and Application
Wang, Chenxi
Suga, Tadatomo
2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 143 - 148
[40] SIMULATION SYSTEM BASED ON THERMOELASTIC WAFER MODEL
MOKUYA, K
MATSUBA, I
KIYOKUNI, Y
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (8B) : C448 - C448

← 1 2 3 4 5 →