An automation route to upgrading fabs toward 300mm

被引：0
|
作者：
Brain, M [1 ]
机构：
[1] Asyst Technol Inc, Fremont, CA 94538 USA
来源：
SOLID STATE TECHNOLOGY | 2000年 / 43卷 / 10期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Today's wafer fab automation capabilities, particularly those associated with minienvironments, enable competitive upgrading of existing facilities, Indeed, in a number of cases, a minienvironment-based fab upgrade strategy has proven to be a low-risk means to improve the performance of an existing facility. This approach is a viable alternative to a new facility that still keeps semiconductor manufacturers on a route to an eventual 300mm fab.
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页码：69 / +
页数：5
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