300mm factory automation experience and challenges for wafer foundry fabs

As the semiconductor industry increases interest in 300 nun wafer size transition, Taiwan Semiconductor Manufacturing Company (TSMC) also participates the 300 min development and mass production. TSMC uses a pilot line of 4.5 K monthly output capacity to gain process and tool expertise and to develop appropriate 300 mm factory automation know-how for the set-up of the next several mass production 300 mm Fabs. The goal is to achieve or exceed the current 200 mm foundry sen,ice, which offers leading edge technology, good on-time delivery, and excellent product quality for 300 mm Fabs. A lot of experience has been learned and sonic challenges have been identified after operating this 300 mm pilot line for one year. These learned experience and challenges are discussed in this paper.