Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni Under Bump Metallization during Multiple Reflows

被引：1

作者：

Koo, Ja-Myeong ^{[1
]}

Jung, Seung-Boo ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 440746, South Korea

来源：

THERMEC 2006 SUPPLEMENT: 5TH INTERNATIONAL CONFERENCE ON PROCESSING AND MANUFACTURING OF ADVANCED MATERIALS | 2007年 / 15-17卷

关键词：

Sn-Pb (tin-lead) solder; intermetallic compound (IMC); multiple reflows; ball shear test; flip chip; electroplating; Ni under bump metallization (Ni UBM);

D O I：

10.4028/www.scientific.net/AMR.15-17.181

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The interfacial reactions and bump shear properties of the electroplated Sn-37Pb (in wt.%) solder bumps with the Ni under bump metallization (UBM) were investigated as a function of the number of reflows. A continuous facetted Ni3Sn4 intermetallic compound (IMC) layer was formed at the interface between the solder bump and the Ni UBM during reflow. The thickness of the Ni3Sn4 IMC layer was 0.41 mu m after 1 reflow, and then the thickness of the IMC layer increased with increasing the number of reflows. The shear properties of the bumps indicated the maximum values after 1 reflow, and then decreased with increasing the number of reflows. The fracture surfaces of the bumps showed ductile failure characteristics after 1 reflow, and then the fraction of the brittle fracture, induced by the IMC formed at the interface, increased with increasing the number of reflows.

引用

页码：181 / 186

页数：6

共 50 条

[21] Reliability of the Pb-free solder bump on electroless Ni under bump metallurgies
Kim, N.S.
Jung, S.Y.
Oh, S.Y.
Proc Electron Compon Technol Conf, 1600, (77-82):
[22] Reliability of the Pb-free solder bump on electroless Ni under bump metallurgies
Kim, NS
Jung, SY
Oh, SY
53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 77 - 82
[23] Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn58Bi solder during annealing
Bi-Lian Young
Jenq-Gong Duh
Journal of Electronic Materials, 2001, 30 : 878 - 884
[24] Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn58Bi solder during annealing
Young, BL
Duh, JG
JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (07) : 878 - 884
[25] Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
Huang, CP
Chen, C
Liu, CY
Lin, SS
Chen, KH
JOURNAL OF MATERIALS RESEARCH, 2005, 20 (10) : 2772 - 2779
[26] Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
Chang Pin Huang
Chih Chen
C. Y. Liu
S. S. Lin
K. H. Chen
Journal of Materials Research, 2005, 20 : 2772 - 2779
[27] Crystallization of electroless Ni-P under bump metallization induced by solder reaction
Jang, JW
Kim, PG
Tu, KN
Frear, DR
INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 1999, : 252 - 255
[28] elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging
Guh-Yaw Jang
Jenq-Gong Duh
Journal of Electronic Materials, 2006, 35 : 2061 - 2070
[29] Elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-bump metallization during aging
Jang, Guh-Yaw
Duh, Jenq-Gong
JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (11) : 2061 - 2070
[30] Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization
Wu, Albert T.
Hua, F.
JOURNAL OF MATERIALS RESEARCH, 2007, 22 (03) : 735 - 741

← 1 2 3 4 5 →