A Compact Model for Metal-Oxide Resistive Random Access Memory With Experiment Verification

被引:161
|
作者
Jiang, Zizhen [1 ]
Wu, Yi [1 ,2 ]
Yu, Shimeng [1 ,3 ]
Yang, Lin [4 ]
Song, Kay [4 ]
Karim, Zia [4 ]
Wong, H. -S. Philip [1 ]
机构
[1] Stanford Univ, Stanford SystemX Alliance, Dept Elect Engn, Stanford, CA 94305 USA
[2] Oracle Corp, Santa Clara, CA 95054 USA
[3] Arizona State Univ, Tempe, AZ 85281 USA
[4] AIXTRON Inc, Sunnyvale, CA 94089 USA
基金
美国国家科学基金会;
关键词
Compact model; experimental verification; OXRAM; ReRAM; resistive random access memory (RRAM); variations; Verilog-A; SWITCHING PARAMETER VARIATION; DEVICE;
D O I
10.1109/TED.2016.2545412
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A dynamic Verilog-A resistive random access memory (RRAM) compact model, including cycle-to-cycle variation, is developed for circuit/system explorations. The model not only captures dc and ac behavior, but also includes intrinsic random fluctuations and variations. A methodology to systematically calibrate the model parameters with experiments is presented and illustrated with a broad set of experimental data, including multilayer RRAM. The physical meanings of the various model parameters are discussed. An example of applying the RRAM cell model to a ternary content-addressable-memory (TCAM) macro is provided. Tradeoffs on the design of RRAM devices for the TCAM macro are discussed in the context of the energy consumption and worst case latency of the memory array.
引用
收藏
页码:1884 / 1892
页数:9
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