Novel Integrated Package-on-Package for Wafer Level and Panel Level Production

被引：0
|
作者：
Koh, Wei [1 ]
机构：
[1] Pacrim Technol, Irvine, CA 92602 USA
来源：
2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2020年
关键词：
ultrathin; integration; Package-on-Package;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Wafer Level Packaging (WLP) technology has grown to become the backbone of miniaturization solution for mobile devices. Package on Package (PoP) in particular is used to combine memory and APU SOC in smartphones. Here, a novel, ultrathin, integrated PoP (InPoP) suitable for either wafer level or panel level production is described in detail.
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页数：5
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