Dissolution of Voids during Compression Molding of SMC

被引:7
|
作者
Lundstrom, T. S. [1 ]
Holmgren, A. [1 ]
机构
[1] Lulea Univ Technol, Div Fluid Mech, SE-97187 Lulea, Sweden
关键词
voids; experimental; diffusion; Henrys law; SMC; bubbles; MATRIX COMPOSITES; TRANSPORT; COLLAPSE;
D O I
10.1177/0731684409336369
中图分类号
TB33 [复合材料];
学科分类号
摘要
During compression molding of sheet molding compounds air bubbles are formed that can deteriorate several properties of the final composite. The story of such bubbles is directly set by the local pressure distribution during pressing. A number of experiments have therefore been performed in order to derive the relation between the pressure and dissolution rate of some gases into relevant resins. The experimental results follow Henry's law up to a pressure of 0.7 MPa and the rate of dissolution is highest for CO(2) in pure polyester. When applying the results to the process in focus it is found that even large bubbles can be dissolved into the liquid resin during manufacturing. Hence, there is a potential to produce parts with very low void content.
引用
收藏
页码:1826 / 1837
页数:12
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