NUMERICAL-SIMULATION OF NONISOTHERMAL SMC (SHEET MOLDING COMPOUND) MOLDING

被引:9
|
作者
TWU, JT [1 ]
HILL, RR [1 ]
WANG, TJ [1 ]
LEE, LJ [1 ]
机构
[1] OHIO STATE UNIV,DEPT CHEM ENGN,COLUMBUS,OH 43210
关键词
D O I
10.1002/pc.750140608
中图分类号
TB33 [复合材料];
学科分类号
摘要
Design of molding tools and molding cycles for sheet molding compounds (SMC) is often expensive and time consuming. Computer simulation of the compression molding process is a desirable approach for reducing actual experimental runs. The focus of this work is to develop a computer model that can simulate the most important features of SMC compression molding, including material flow, heat transfer, and curing. A control volume/finite element approach was used to obtain the pressure and velocity fields and to compute the flow progression during compression mold filling. The energy equation and a kinetic model were solved simultaneously for the temperature and conversion profiles. Differential scanning calorimetry (DSC) was used to experimentally measure the polymerization kinetics. A rheometrics dynamic analyzer (RDA) was used to measure the rheological changes of the compound. A series of molding experiments was conducted to record the flow front location and material temperature. The results were compared to simulated flow front and temperature profiles.
引用
收藏
页码:503 / 514
页数:12
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