Integrated optical interconnections on printed circuit boards

被引:2
|
作者
Riester, Markus [1 ]
Langer, Gregor [1 ]
Leising, Gunther [2 ]
机构
[1] AT&S Austria Technol & Syst Tech AG, Fabriksgasse 13, A-8700 Leoben, Austria
[2] Joanneum Res, Inst Nanostruct Mat & Photon, A-8160 Weiz, Austria
来源
PHOTONICS PACKAGING, INTEGRATION, AND INTERCONNECTS VII | 2007年 / 6478卷
关键词
optical circuit; printed circuit board; two-photon absorption; miniaturization; passive alignment; embedding technology;
D O I
10.1117/12.713937
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
The development of integrated optical interconnections (IOIs) represents a quantum leap for the functionality of printed circuit boards (PCBs). This new technology will allow highly complex product features and hence, higher product added value. PCBs with optical interconnections will be used where applications call either for very high data streams between components, modules or functional units (e.g. backplanes or multiprocessor boards) or for a space-saving design for interconnection paths (e.g. mobile applications). We discuss the different approaches towards integrating optical waveguides into PCBs and analyze the prerequisites for a transfer to a product. Application scenarios for different markets are presented and steps proposed for required action to deliver solutions that can be driven into a market. In a second section a new and innovative concept for the integration of an optical interconnection system in PCBs is presented. This revolutionary concept is highly supporting the worldwide trend towards miniaturization of not only electronic but also optoelectronic systems in PCBs. The alignment of the optoelectronic components to the waveguides has been addressed by this concept. It is shown that the process will allow the tolerances incurred in the manufacturing processes to be dealt with in a separate process step, allowing existing standard methods for the production of electronic interconnection systems to be used.
引用
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页数:11
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