PYROLYSIS OF PRINTED CIRCUIT BOARDS

The paper is focused on the comparison pyrolysis of printed circuit boards sample at 400 degrees C, 500 degrees C and 600 degrees C and verifying the possibility of thermal decomposition in obtaining selected metals from this type of electronic scrap. The experiment was performed on a sample composed from various crushed printed circuit boards. Analyses were primarily aimed at verifying the concentrations of selected metals such as Cu, Pd, Ag, Sn, Au and Pb in the solid residue after thermal processing and forming a gaseous phase within the given temperature. During pyrolytic thermal decomposition the increase of the gas volume and nature of the solid residue were monitored. It was found that the smallest amount of the solid residue was formed at the temperature of 600 degrees C, therefore the highest recovery of metals was observed at this temperature. In other words, it can be said that the weight loss of the pyrolysed waste grows with the growing time and temperature. It is mostly owing to the fact that most of the plastics is not thermally degradable below the temperature of 400 degrees C.