New approaches in the transient thermal measurements

被引：28
|
作者：
Székely, V
Ress, S
Poppe, A
Török, S
Magyari, D
Benedek, Z
Torki, K
Courtois, B
Rencz, M
机构：
[1] Tech Univ Budapest, Dept Electron Devices, H-1521 Budapest, Hungary
[2] TIMA Lab, F-38031 Grenoble, France
[3] MicReD Ltd, H-1112 Budapest, Hungary
来源：
MICROELECTRONICS JOURNAL | 2000年 / 31卷 / 9-10期
基金：
匈牙利科学研究基金会;
关键词：
thermal transient testing; thermal transient tester; multi-port models; reduced order models;
D O I：
10.1016/S0026-2692(00)00051-3
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the first part of the paper a thermal transient measurement approach is presented that can be applied for the generation of multi-port compact dynamic thermal models of IC packages. Experimental results prove the applicability of the ideas. In the second part of the paper the recent advances in the development of the appropriate measurement tools are described. Among others the authors present a new thermal transient test chip, and T3ster, a new thermal transient tester equipment, developed for high precision one-port or multi-port transient thermal measurements. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：727 / 733
页数：7
相关论文
共 50 条
  • [1] CARS APPROACHES TO SPECIES MEASUREMENTS IN TRANSIENT MEDIA
    ECKBRETH, AC
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1985, 190 (SEP): : 32 - PHS
  • [2] THERMAL MEASUREMENTS ON SMALL TRANSIENT SYSTEMS
    HILL, RAW
    NATURE, 1952, 170 (4314) : 29 - 30
  • [3] Advanced Stand for Transient Thermal Measurements
    Torzewicz, T.
    Sobczak, A.
    Janicki, M.
    Napieralski, A.
    2017 IEEE 30TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS (MIEL), 2017, : 239 - 242
  • [4] Crosstalk Compensation in Thermal Transient Measurements
    Szabo, Peter G.
    Szekely, Vladimir
    INFOCOMMUNICATIONS JOURNAL, 2012, 4 (03): : 9 - 14
  • [5] BOUNDARY EFFECTS IN TRANSIENT THERMAL MEASUREMENTS
    MADSEN, J
    TREFNY, J
    JOURNAL OF PHYSICS E-SCIENTIFIC INSTRUMENTS, 1987, 20 (11): : 1362 - 1365
  • [6] Increasing the accuracy of thermal transient measurements
    Székely, V
    Rencz, M
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (04): : 539 - 546
  • [7] New method of measurements transient thermal impedance and radial power of power LEDs
    Gorecki, Krzysztof
    Ptak, Przemyslaw
    IEEE Transactions on Instrumentation and Measurement, 2020, 69 (01): : 212 - 220
  • [8] New Method of Measurements Transient Thermal Impedance and Radial Power of Power LEDs
    Gorecki, Krzysztof
    Ptak, Przemyslaw
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2020, 69 (01) : 212 - 220
  • [9] Thermal Transient Measurements of GaN HEMT Structures by Electrical Measurements
    Kristensen, Tobias
    Divinyi, Andreas
    Bremer, Johan
    Nilsson, Torbjorn M. J.
    Thorsell, Mattias
    2023 18TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, EUMIC, 2023, : 293 - 296
  • [10] NEW APPROACHES TO FLUORESCENCE MEASUREMENTS
    CHRISTIAN, GD
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1980, 179 (MAR): : 52 - ANAL
12345