Development of constitutive equations and novel methodology for failure prediction models for SAC lead-free alloys

被引:0
|
作者
Agonafer, Dereje [1 ]
Hossain, Mohammad Masum [1 ]
机构
[1] Univ Texas Arlington, Elect MEMS & Nano Syst Packaging Ctr, Arlington, TX 76019 USA
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:13 / +
页数:2
相关论文
共 50 条
  • [41] Thermal property, wettability and interfacial characterization of novel Sn-Zn-Bi-In alloys as low-temperature lead-free solders
    Liu, Jian-Chun
    Zhang, Gong
    Wang, Zheng-Hong
    Ma, Ju-Sheng
    Suganuma, Katsuaki
    MATERIALS & DESIGN, 2015, 84 : 331 - 339
  • [42] Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys
    Huang Yongle
    Luo Yifei
    Xiao Fei
    Liu Binli
    Tang Xin
    MICROELECTRONICS RELIABILITY, 2020, 109
  • [43] Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes
    Li, Y
    Moon, KS
    Wong, CP
    55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 1462 - 1467
  • [44] Methodology proposal for the development of failure prediction models applied to conveyor belts of mining material using machine learning
    Gunckel, Pablo Viveros
    Lobos, Giovanni
    Rodriguez, Fredy Kristjanpoller
    Bustos, Rodrigo Mena
    Godoy, David
    RELIABILITY ENGINEERING & SYSTEM SAFETY, 2025, 256
  • [45] Board Level Reliability assessment of Wafer Level Chip Scale Packages for SACQ, a lead-free solder with a novel life prediction model
    Muthuraman, Balaji Nandhivaram
    Canete, Baltazar
    2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
  • [46] Viscoplastic characterization and mechanical strength of novel Sn-1.7Ag-0.7Cu lead-free solder alloys with microalloying of Te and Co
    El-Daly, A. A.
    Ibrahiem, A. A.
    Abdo, M. A.
    Eid, N. A. M.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (14) : 12937 - 12949
  • [47] Development of a Novel Methodology for Remaining Useful Life Prediction of Industrial Slurry Pumps in the Absence of Run to Failure Data
    Khan, Muhammad Mohsin
    Tse, Peter W.
    Trappey, Amy J. C.
    SENSORS, 2021, 21 (24)
  • [48] Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead-free solder alloys with microalloying of Te and Co
    A. A. El-Daly
    A. A. Ibrahiem
    M. A. Abdo
    N. A. M. Eid
    Journal of Materials Science: Materials in Electronics, 2019, 30 : 12937 - 12949
  • [49] Development of the damage state variable for a unified creep plasticity damage constitutive model of the 95.5Sn-3.9Ag-0-6Cu lead-free solder
    Pierce, David M.
    Sheppard, Sheri D.
    Fossurn, Arlo F.
    Vianco, Paul T.
    Neilsen, Mike K.
    JOURNAL OF ELECTRONIC PACKAGING, 2008, 130 (01) : 0110021 - 01100210
  • [50] A model development of lead-free Cs3Sb2Br9 based novel perovskite solar cell by SCAPS-1D
    Sachchidanand
    Garg, Vivek
    Kumar, Anil
    Sharma, Pankaj
    2021 IEEE 48TH PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC), 2021, : 1199 - 1203