Development of constitutive equations and novel methodology for failure prediction models for SAC lead-free alloys

被引:0
|
作者
Agonafer, Dereje [1 ]
Hossain, Mohammad Masum [1 ]
机构
[1] Univ Texas Arlington, Elect MEMS & Nano Syst Packaging Ctr, Arlington, TX 76019 USA
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:13 / +
页数:2
相关论文
共 50 条
  • [31] Prediction of Fatigue Resistance in Lead-Free Ni-Doped SAC 1205 Solder Alloys Using a Rate-Dependent Material Model and Subjected to Drop Tests
    Wu, Mei-Ling
    Lan, Jia-Shen
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (10): : 1777 - 1787
  • [32] Development of lead-free solder alloys of the Ge doped Sn-Ag-Bi system
    Habu, K
    Takeda, N
    Watanabe, H
    Ooki, H
    Abe, J
    Saito, T
    Taniguchi, Y
    Takayama, K
    FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS, 1999, : 606 - 609
  • [33] Development of novel green methods for preparation of lead-free preserved pidan (duck egg)
    Hou, Chih-Yao
    Lin, Chia-Min
    Patel, Anil Kumar
    Dong, Chengdi
    Shih, Ming-Kuei
    Hsieh, Chang-Wei
    Hung, Yu-Lin
    Huang, Ping-Hsiu
    JOURNAL OF FOOD SCIENCE AND TECHNOLOGY-MYSORE, 2023, 60 (03): : 966 - 974
  • [34] Development of novel green methods for preparation of lead-free preserved pidan (duck egg)
    Chih-Yao Hou
    Chia-Min Lin
    Anil Kumar Patel
    Chengdi Dong
    Ming-Kuei Shih
    Chang-Wei Hsieh
    Yu-Lin Hung
    Ping-Hsiu Huang
    Journal of Food Science and Technology, 2023, 60 : 966 - 974
  • [35] Prediction of stress-strain relationship with an improved Anand constitutive model for lead-free solder Sn-3.5Ag
    Chen, X
    Chen, G
    Sakane, M
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (01): : 111 - 116
  • [36] Validation of a general fatigue life prediction methodology for sn-ag-cu lead-free solder alloy interconnects
    Pierce, David M.
    Sheppard, Sheri D.
    Vianco, Paul T.
    Regent, Jerome A.
    Grazier, J. Mark
    JOURNAL OF ELECTRONIC PACKAGING, 2008, 130 (01) : 0110031 - 01100312
  • [37] Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect
    I. Dutta
    B. S. Majumdar
    D. Pan
    W. S. Horton
    W. Wright
    Z. X. Wang
    Journal of Electronic Materials, 2004, 33 : 258 - 270
  • [38] Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect
    Dutta, I
    Majumdar, BS
    Pan, D
    Horton, WS
    Wright, W
    Wang, ZX
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (04) : 258 - 270
  • [39] Development of low-firing lead-free thick-film materials on steel alloys for piezoresistive sensor applications
    Jacq, Caroline
    Maeder, Thomas
    Ryser, Peter
    2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 116 - 121
  • [40] Development of a Novel Microimpact-Fatigue Tester and Its Application to Impact Reliability of Lead-Free Solder Joints
    Kim, Ilho
    Lee, Soon-Bok
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (03): : 542 - 549