共 50 条
- [1] Acceleration models, constitutive equations, and reliability of lead-free solders and joints 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 229 - 236
- [3] Constitutive models of creep for lead-free solders Journal of Materials Science, 2009, 44 : 3841 - 3851
- [4] Constitutive model and parameter identification for lead-free SAC305 solder 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2020,
- [5] Reflow profile optimization for lead-free (SAC) alloys in BGA applications EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 708 - 716
- [6] Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1608 - 1613
- [9] Damage constitutive model and failure mechanism of lead-free solder in CBGA package MATERIALS AND PRODUCT TECHNOLOGIES, 2008, 44-46 : 77 - 83
- [10] Constitutive behaviour and life prediction of lead-free solder joints based on energy Cailiao Kexue yu Gongyi, 2009, SUPPL. 2 (67-72):