Electrochemistry of copper in chemical mechanical planarization (CMP) slurries containing glycine and hydrogen peroxide

This study aims to improve our understanding of the removal mechanisms during copper CMP using hydrogen peroxide-glycine based slurries. First, copper dissolution behavior was examined in aqueous glycine solutions in the absence of H2O2 by correlating the results of potentiodynamic polarization experiments with the appropriate potential-pH diagram for the copper-water-glycine system. The polishing behavior in the absence of H2O2 was examined by in-situ polarization experiments. Finally, weight loss and polishing experiments were conducted to investigate the electrochemistry of copper in glycine solutions and slurries with different amounts H2O2.