Stencil printing at sub-100 microns pitch

被引：3
|
作者：
Desmulliez, MPY [1 ]
Kay, RW [1 ]
Stoyanov, S [1 ]
Bailey, C [1 ]
机构：
[1] Heriot Watt Univ, Sch Engn & Phys Sci, MISEC, Edinburgh EH14 4AS, Midlothian, Scotland
来源：
6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004) | 2004年
关键词：
D O I：
10.1109/EPTC.2004.1396633
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 lead-free solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.
引用
收藏
页码：354 / 358
页数：5
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