CMP Behavior of α-Alumina-g-Polyvinylpyrrolidone Composite Abrasive on Hard Disk Substrate

被引：0
|
作者：
Lei, Hong [1 ]
Bu, Naijing [1 ]
Chu, Fengling [1 ]
Hao, Ping [1 ]
Hu, Xiaoli [1 ]
机构：
[1] Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai, Peoples R China
来源：
MANUFACTURING SCIENCE AND ENGINEERING, PTS 1-5 | 2010年 / 97-101卷
关键词：
Chemical mechanical polishing; Hard disk substrate; alpha-Alumina-g-polyvinylpyrrolidone; Composite abrasive; Cleaning; NANOPARTICLE IMPACTS; HOLLOW SPHERES; DEFORMATION; COATINGS; SURFACE;
D O I：
10.4028/www.scientific.net/AMR.97-101.2135
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A novel alpha-alumina-g-polyvinylpyrrolidone (alpha-Al(2)O(3)-g-PVP) composite abrasive was prepared by surface grafting polymerization. The chemical mechanical polishing (CMP) performances of the composite abrasive on hard disk substrate were investigated with a UNIPOL-1502 polishing machine. Analyses on the surface of polished substrate indicated that the alpha-Al(2)O(3)-g-PVP composite abrasive exhibited lower surface roughness, less scratch, and improved post-CMP cleaning performances than pure alpha-alumina abrasive under the same testing conditions.
引用
收藏
页码：2135 / 2139
页数：5
相关论文
共 50 条
  • [41] Effect of K2S2O8 on material removal rate in abrasive-free polishing of hard disk substrate
    Zhao, Rong
    Lei, Hong
    MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013, 690-693 : 3222 - 3225
  • [42] Research on Material Removal Rate of CMP 6H-SiC Crystal Substrate (0001) Si Surface Based on Abrasive Alumina (Al2O3)
    Su Jianxiu
    Du Jiaxi
    Liu Haina
    Liu Xinglong
    INTERNATIONAL CONFERENCE ON ADVANCES IN ENGINEERING 2011, 2011, 24 : 441 - 446
  • [43] Study on Material Removal Rate of CMP 6H-SiC Crystal Substrate (0001) C Surface Based on Abrasive Alumina (Al2O3)
    Su Jianxiu
    Du Jiaxi
    Liu Xinglong
    Liu Haina
    ULTRA-PRECISION MACHINING TECHNOLOGIES, 2012, 497 : 250 - +
  • [44] Effect of Benzoyl Peroxide/N, N-Dimethyl aniline initiating system on material removal rate in abrasive-free polishing of hard disk substrate
    Jiang, Ting
    Lei, Hong
    2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT), 2014, : 325 - 329
  • [45] Abrasive-free polishing of hard disk substrate with H2O2-K2S2O8-NaHSO3 slurry
    Zhang, Weitao
    Lei, Hong
    MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013, 690-693 : 3209 - 3212
  • [46] Polishing Mechanism of CMP 4H-SiC Crystal Substrate (0001) Si Surface Based on an Alumina (Al2O3) Abrasive. (vol 17, 679, 2024)
    Gong, Juntao
    Wang, Weilei
    Liu, Weili
    Song, Zhitang
    MATERIALS, 2024, 17 (13)
  • [47] Oxidation and Thermal Shock Behavior of a Glass-Alumina Composite Coating on K38G Superalloy at 1000℃
    Minghui Chen
    JournalofMaterialsScience&Technology, 2012, 28 (05) : 433 - 438
  • [48] Oxidation and Thermal Shock Behavior of a Glass-Alumina Composite Coating on K38G Superalloy at 1000 °C
    Chen, Minghui
    Shen, Mingli
    Wang, Xin
    Zhu, Shenglong
    Wang, Fuhui
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2012, 28 (05) : 433 - 438
  • [49] Abrasive-free polishing of hard disk substrate with H2O2-C4H10O2-Na2S2O5 slurry
    Weitao Zhang
    Hong Lei
    Friction, 2013, 1 : 359 - 366
  • [50] Abrasive-free polishing of hard disk substrate with H2O2-C4H10O2-Na2S2O5 slurry
    Zhang, Weitao
    Lei, Hong
    FRICTION, 2013, 1 (04) : 359 - 366
12345