CMP Behavior of α-Alumina-g-Polyvinylpyrrolidone Composite Abrasive on Hard Disk Substrate

被引：0
|
作者：
Lei, Hong [1 ]
Bu, Naijing [1 ]
Chu, Fengling [1 ]
Hao, Ping [1 ]
Hu, Xiaoli [1 ]
机构：
[1] Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai, Peoples R China
来源：
MANUFACTURING SCIENCE AND ENGINEERING, PTS 1-5 | 2010年 / 97-101卷
关键词：
Chemical mechanical polishing; Hard disk substrate; alpha-Alumina-g-polyvinylpyrrolidone; Composite abrasive; Cleaning; NANOPARTICLE IMPACTS; HOLLOW SPHERES; DEFORMATION; COATINGS; SURFACE;
D O I：
10.4028/www.scientific.net/AMR.97-101.2135
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A novel alpha-alumina-g-polyvinylpyrrolidone (alpha-Al(2)O(3)-g-PVP) composite abrasive was prepared by surface grafting polymerization. The chemical mechanical polishing (CMP) performances of the composite abrasive on hard disk substrate were investigated with a UNIPOL-1502 polishing machine. Analyses on the surface of polished substrate indicated that the alpha-Al(2)O(3)-g-PVP composite abrasive exhibited lower surface roughness, less scratch, and improved post-CMP cleaning performances than pure alpha-alumina abrasive under the same testing conditions.
引用
收藏
页码：2135 / 2139
页数：5
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